July • August 2018; Volume 22, Number 4
Zuken’s CR-8000 PCB and package layout design tools enable multiple chips, packages and boards to be assembled, viewed and edited on one canvas in either 2D- or 3D-mode. The image shows a three-die stack on a silicon interposer that is wire bonded to a package and placed on a board. A simple click into any one of these components in a hierarchy tree switches edit context to the selected part, including its specific technology, rules and layer stack-up.
Cover image courtesy of Zuken USA Inc.
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With extensive product and process development expertise, customers can utilize Bourns for:
We help fabless IC companies miniaturize and productize their chip-level designs into MMICs, CMOS, SiGe, GaAs, InP, GaN or SiC Multiple-Chip Modules, 100-400Gbps Optoelectronic Packages or RF/Microwave Board Assemblies.
Clinton, NY USA - July 26, 2018 -
Indium Corporation and MEL Systems and Services Ltd. (MELSS) have formed a strategic partnership to expand accessibility to Indium Corporation soldering materials throughout India. MELSS will be selling all of Indium Corporation’s soldering materials, such as low-voiding solder paste and solder preforms for bottom termination components, solder wire for hand and robotic soldering, and rework fluxes.
Tempe, AZ USA - July 18, 2018 -
Amkor Technology announced today it has partnered with Mentor to release Amkor's SmartPackage™ Package Assembly Design Kit (PADK), the first in the industry to support Mentor's High-Density Advanced Packaging (HDAP) design process and tools. Amkor's award-winning High-Density Fan Out (HDFO) process can now be used in conjunction with Mentor's software to deliver early, rapid and accurate verification results of advanced packages required for Internet-of-Things, automotive, high-speed communications, computing and artificial intelligence applications.
Somerset, NJ – May 9th, 2018 –
Alpha Assembly Solutions, a world leader in the production of electronic soldering and bonding materials, has recently announced their acquisition of HiTech Korea Co., LTD (HiTech), a premier electronics assembly polymer and epoxy-based materials supplier, with its primary operational facility in Korea.
Poway, CA., & Norwood, MA - May 8, 2018 -
Cohu, Inc. (NASDAQ:COHU) and Xcerra Corporation (NASDAQ:XCRA) announced they have entered into a definitive merger agreement pursuant to which Cohu will acquire Xcerra for a combination of cash and stock. The acquisition is expected to make Cohu a global leader in semiconductor test, with combined sales for Cohu and Xcerra in excess of $800 million for the last twelve months.
St. Florian, Austria, May 2, 2018 -
EV Group (EVG) announced that it has started construction work for the next expansion phase of its corporate headquarters. The new, state-of-the-art building will house EVG's "Manufacturing III" facility, which will more than double the floor space for the final assembly of EVG's systems.
April 30, 2018 Kaohsiung City, Taiwan -
ASE Industrial Holding Co., Ltd. is jointly established by the combination of Advanced Semiconductor Engineering, Inc. and Siliconware Precision Industries Co., Ltd (SPIL). ASE Industrial Holding will enhance research and development capability, expand global market footprint, contribute advanced technical support for next-generation applications, and provide miniaturized, high-quality, highly integrated, and fast time-to-market services to all customers.
Singapore and Hong Kong, April 3rd, 2018 -
ASM Pacific Technology Ltd. (“ASMPT”) announced that it has completed its acquisition of 100% of the shares of AMICRA Microtechnologies GmbH (“Amicra”). Amicra is a leading supplier of high-precision die bonders for the photonics and advanced packaging markets. The transaction, which completed on April 4, 2018 will bring about a strengthened business, well-placed to serve not only the fast growing silicon photonics assembly equipment market, but also the wider high-precision flip-chip and die bonding markets.
Singapore and Hong Kong, April 3rd, 2018 -
ASM Pacific Technology Ltd. (ASMPT) announced that it has signed a definitive agreement with Tokyo Electron Limited (TEL) to acquire TEL NEXX, Inc. (NEXX). The deal is expected to close when approvals from the authorities have been received. The acquisition is another major step by the Group in pursuing its growth strategy of tapping into new high-growth markets and expanding their product offerings to the semiconductor advanced packaging market.
San Jose, CA USA - July 25, 2018 – The SMTA and Chip Scale Review are pleased to announce the Keynote Presenters and program for the 15th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 23-25, 2018 at the DoubleTree by Hilton Hotel in San Jose, California. A compelling technical program awaits in this year’s conference. The technical program has three parallel tracks with two full days of presentations on wafer-level packaging, 3D integration, and advanced manufacturing technologies. Building on last year’s success IWLPC will again feature an international stage panel discussion entitled: “Scaling-Up Panel-Level Processing: Challenges and Opportunities”. IWLPC will deliver four Professional Development Courses and an Interactive Poster Presentation Session. Three keynote talks by distinguished leaders in the industry will take center stage.
Grenoble, France - September 19-21, 2018 -MEMS and sensors devices are applied in a diverse and growing list of products – mobile, automotive, industrial, health/medical, etc. With the top MEMS and sensors producers, RTO’s, Start-ups located in Europe, Grenoble is a fitting location to connect international experts and industry executives with each other.
Grenoble, France - September 19-21, 2018 - Imaging and Sensors applications are growing rapidly and the use of their devices is increasing: automotive, industrial, medical and agricultural applications drive to dramatic progress.
Singapore, July 27, 2018 – The Final Call for papers date for the 20th Electronics Packaging Technology Conference (EPTC 2018) has been announced. The EPTC 2018 conference is an International event organized by the IEEE RS/EPS /EDS Singapore Chapter and co-sponsored by IEEE Electronics Packaging Society (EPS). ...>>