Eutectic bonding is an area of particular interest to photonics, microwave and RF electronics, because of the need for a clean,highly thermally efficient process, as well as for long-term reliability. Increasing demand for communications data and bandwidth accelerates the adaptation of full automation and the improvement of processes in advanced eutectic packaging for volume production.These advances result in high-precision, high-throughput, improved yield, and new products for the component and module manufacturers.
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Belle étoile, Alpexpo, Grenoble, France - October 25–26, 2016 - Advanced packaging technology development has always been driven by the consumer market, namely by mobile and wireless communication applications, always targeting to find solutions for those key critical aspects of packaging: Performance, Form-Factor and Cost. ...>>
A*STAR’S IME LAUNCHES CHIP-ON-WAFER CONSORTIUM II AND COST- EFFECTIVE INTERPOSER CONSORTIUM TO ADVANCE CHIP PACKAGING SOLUTIONS FOR HIGH-VOLUME MANUFACTURING ...>>
Tokyo, Japan and St. Petersburg, FL - May 31, 2016 — DISCO Corporation, the world's largest dicing equipment provider, has signed a global distribution agreement with Plasma-Therm for its plasma dicing technology, the companies announced on May 31, 2016 ...>>
Minneapolis, MN - August 23, 2016 - The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are preeminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California. ...>>