Thin wafer handling by temporarily bonding device wafers to a supporting carrier has been widely used for advanced packaging of high-efficiency and high-performance devices used in computing, networking, sensors and consumer electronics applications. Temporary bonding material is a significant factor in this process and has evolved substantially over the last decade to enable handling of extremely thin wafers in harsh environments during wafer processing.
Cover image courtesy of Brewer Science Inc.
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San Jose, CA – November 14, 2016 – MEPTEC has moved to participate in the new technology roadmap focused on heterogeneous integration, to be modeled after the ITRS which closed in 2015 ...>>
Vila do Conde, Porto, Portugal – September 29th, 2016 – Vila do Conde, Porto, Portugal – September 29th, 2016 – NANIUM S. A., acknowledged for its experience in designing and developing innovative semiconductor packaging solutions, today announced it has developed the first Wafer-Level Fan-Out (WLFO) package for biomedical microfluidic application, embedding a 5.5x1.2mm2 bio-detection chip on a 10x4mm2 WLFO package that includes a 8mm long fluid channel. ...>>
Belle étoile, Alpexpo, Grenoble, France - October 25–26, 2016 - Advanced packaging technology development has always been driven by the consumer market, namely by mobile and wireless communication applications, always targeting to find solutions for those key critical aspects of packaging: Performance, Form-Factor and Cost. ...>>
A*STAR’S IME LAUNCHES CHIP-ON-WAFER CONSORTIUM II AND COST- EFFECTIVE INTERPOSER CONSORTIUM TO ADVANCE CHIP PACKAGING SOLUTIONS FOR HIGH-VOLUME MANUFACTURING ...>>
Tokyo, Japan and St. Petersburg, FL - May 31, 2016 — DISCO Corporation, the world's largest dicing equipment provider, has signed a global distribution agreement with Plasma-Therm for its plasma dicing technology, the companies announced on May 31, 2016 ...>>
Minneapolis, MN - August 23, 2016 - The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are preeminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California. ...>>