March • April 2016; Volume 20, Number 2
In the thin chip foil package, ultra-thin dies are placed in a cavity of a film laminate, which results in a bendable fan-out chip package with the fragile IC securely embedded in the center layer. The capability to bend flat chip packages and mount them onto curved surfaces will enable new sensing applications in production environments, healthcare, robotics and potentially any aspect of our daily life.
through standard 300mm lines.
Photo courtesy of Fraunhofer EMFT
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Piscataway, NJ – May 24, 2016 – The IEEE Components, Packaging and Manufacturing Technology Society (CPMT) will recognize its 2016 award winners at the 66th Electronic Components
San Jose, CA - May 18, 2016 - VLSI announces 10 BEST semiconductor equipment supplier rankings for 2016.
19 of the 20 10 BEST suppliers have achieved greater than an 8.0 rating this year. ...>>
San Jose, CA - April 18th, 2016 – Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that Sandia National Laboratories signed a new license agreement for ZiBond® and Direct Bond Interconnect (DBI®) technologies. With this license Sandia will have access to the most advanced 3D integration technologies available, for use in a wide range of semiconductor applications.
1932-2016 Gene Selven
Publisher, Chip Scale Review 1999-2008
San Jose, California ─ April 2, 2016 ─ Those who were fortunate to have known Gene Selven recall a passionate, remarkable person in both business and leisure. His presence would fill a room—there was no escaping it. He was also passionate in everything he did.
Half Moon Bay, CA. - January 12, 2016 - The SEMI Industry Strategy Symposium (ISS) opened yesterday with the theme “Integrating for Growth: Markets, Technology, Ecosystem.” The packed conference of C-level executives gave the year’s first strategic outlook of the global electronics manufacturing industry. Opening keynoter Mary J. Miller, deputy assistant secretary of research and technology at the U.S. Army, discussed future national defense needs and technological innovation capabilities.
San Jose, CA – April 7, 2016 – MEPTEC is pleased to announce that speakers have been announced for the 14th Annual MEMS Technology Symposium. The event will be held May 11 at the Holiday Inn in San Jose, California – USA. ...>>
Minneapolis, MN - March 31, 2016 - The SMTA and Chip Scale Review magazine are pleased to announce the Keynote Presenters for the 13th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California - USA ...>>
Mesa, Arizona - March 6-9, 2016 - At BiTS 2016 we will be examining the test challenges of the Internet of Things (IoT) including the Internet of Vehicles (IoV) and those of Big Data. This is a very rich program - eight presentation sessions, poster session, Keynote Address, and Distinguished Speaker plus an excellent Tutorial spanning four days.