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September • October; Volume 23, Number 5

Cover Photo

An illustration of the latest development towards the integration of ultra-thin silicon bare dies within a flexible film. ChipInFlex is a generic wafer-level process for manufacturing a flexible label that integrates silicon components. Working on a silicon carrier helps achieve a high resolution of integration. The process described is the first to offer flipchip silicon dies interconnection within a flexible film and collective thinning.

 

Photo courtesy of CEA-Leti


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Mentor, a Siemens Business

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