Automotive applications are driving a number of packaging technologies, such as reliability of packaging materials and screening of SoCs. But flexible hybrid electronics (e.g., for biosensors and personal wearable body monitors) and “More than Moore” nontraditional scaling are also pushing the packaging market segment forward. This issue covers the above topics in detail across a broad swath of the packaging industry.
Cover image courtesy of Brewer Science, Inc.
West Lafayette, IN – June 14, 2019 - Purdue University and the Taiwan Semiconductor Manufacturing Co. (TSMC) jointly announced plans Friday to establish a Center for Secured Microelectronics Ecosystem aimed at ensuring a secure supply of semiconductor chips and related tools all the way from the foundry to the packaged system.
TSMC, located in Hsinchu Science Park, Taiwan, is the world’s largest semiconductor contract manufacturer, and Purdue University officials reached an agreement in Washington, D.C., during the Select USA Conference.
The center, to be located at the Purdue University West Lafayette campus in collaboration with Purdue Research Foundation, will perform research to ensure a secure ecosystem for the manufacture of microelectronics systems.
“Semiconductors will continue to be the enabling backbone for technological and economic growth in the 21st century, propelling advancements in the internet of things, autonomous transportation, artificial intelligence, advanced manufacturing, and many other applications,” U.S. Secretary of Commerce Wilbur Ross said. “We are pleased that TSMC and Purdue University took their partnership to the next level at SelectUSA — a platform for leading global semiconductor manufacturers to continue expanding and investing in the United States. Under President Trump’s leadership, the administration will continue doing all it can to grow and equip our highly skilled workforce, maintain our competitive investment and regulatory environment, and support world-class American research universities.”
Purdue University is ranked 12th among worldwide universities granted U.S. utility patents for 2018 in the annual rankings put out by the National Academy of Inventors and the Intellectual Property Owners Association.
“This agreement solidifies a vital global partnership for Purdue and enables our leading researchers to further advance their discoveries in microelectronics,” Purdue University President Mitch Daniels said. “TSMC’s commitment is only the beginning of what we believe will be an internationally significant initiative.”
The Purdue School of Electrical and Computer Engineering has about 10 faculty members currently collaborating with TSMC at various levels of research.
“TSMC is pleased to have this opportunity to support Purdue’s world-class technology research,” said H.S. Philip Wong, vice president of corporate research at TSMC. “As everyone’s trusted foundry, TSMC believes it would be beneficial to contribute to the development of a secure electronics ecosystem.”
The Purdue School of Electrical and Computer Engineering will lead the research and development in conjunction with TSMC.
“We are truly excited about this opportunity to significantly broaden and deepen the important partnership with TSMC. We anticipate the new center will begin operations at the beginning of the new academic year. At the start, we will focus on developing a secure microelectronics ecosystem,” said Mung Chiang, Purdue’s John A. Edwardson Dean of the Purdue College of Engineering. “We also anticipate that the partnership will grow in the next couple of years to include multiple U.S. universities.”
In February, the Semiconductor Industry Association reported that the global semiconductor industry posted sales of $468.8 billion in 2018, the industry’s highest-ever annual total, and an increase of 13.7 percent compared with the previous year.
“This industry is one of the most important for our global economy and security,” said Chad Pittman, vice president of the Purdue Research Foundation National Security and Defense Program Office and Government Relations. “The strengths in research and development of Purdue and TSMC will help support and advance this critical industry on multiple levels and help secure the ever-advancing microelectronics technology.”
The agreement also allows TSMC to help facilitate access to multi-project wafer shuttle runs to test the effectiveness of the proposed research and to assign representatives on the advisory board of the center to mentor specific projects.
For additional information:
Irving TX - June 17, 2019 - Wayne Pfaff, the founder of Plastronics Socket Company, passed away peacefully on Thursday, June 13 surrounded by his family. Wayne was born on August 2, 1935, in Salinas, California. Wayne, an engineer with a brilliantly creative mind started Plastronics in 1983 with the intent of serving the semiconductor industry with smart solutions to tough problems. The company Wayne started has over 25 patents, which includes the zero-insertion force (ZIF) open top socket used globally across all test socket companies. It is Wayne’s inventions that form the foundation of the burn-in test socket industry we know today. Wayne Pfaff will forever be remembered as an industry leader and innovator and his legacy will continue to live on with David Pfaff, President of Plastronics, and the entire Plastronics team.
Plastronics Socket Company, 2601 Texas Drive, Irving, Texas 75062 - 972-342-1834
Enhancement of Precision Processing Tool Production System and BCM³ Support. The semiconductor and electronic component markets are expected to continue expanding in the future based on the development of IoT, AI, self-driving technologies, and installation of multiple cameras on smartphones. Demands for DISCO’s precision processing equipment and tools are also expected to increase accordingly. DISCO has two production sites, Kuwabata Plant and Kure Plant, in Kure City, Hiroshima. Precision processing equipment and precision processing tools are mainly produced in Kuwabata Plant and Kure Plant, respectively. By allocating a part of the production space in Zone B, Kuwabata Plant, for which construction was completed in January 2015, for precision processing tools, a second production site was established to improve BCM support. Moreover, by making Zone C in A-Building, Kuwabata Plant, for which construction was completed in January 2019, a production space for precision processing tools, DISCO will achieve further enhancement of the production system and BCM support, as well as more effective production through the promotion of automation.
|Name||Zone C in A-Building, Kuwabata Plant|
|Structure||Seismically isolated structure|
|Total floor space||Approx. 65,900 m² (Existing building: Approx. 128,500 m²)|
|Total Investment||Approx. JPY 13.8 billion|
|Construction start||February 2017|
|Construction completion||January 31, 2019|
|Operation start||February 2019|
|Future Plan (Extension of Zone D)|
In order to respond to expected future increases in demand, Zone D will be constructed in A-Building of Kuwabata Plant, following the completion of Zone C.
|Name||Zone D in A-Building, Kuwabata Plant|
|Structure||Seismically isolated structure|
|Total floor space||Approx. 67,400 m²|
|Total Investment||Approx. JPY 14 billion|
|Construction Period||September 2019 – August 2021|
For additional information: Yurika Araya, e-mail: firstname.lastname@example.org
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information: www.indium.com or email email@example.com.
This announcement follows the European Commission’s approval on December 18, 2018 of the ‘Important Project of Common European Interest’ (IPCEI), a joint project by France, Germany, Italy and the UK to give €1.75 billion (approx. $2bn) in public support for research and innovation in microelectronics.
Nano 2022 is France’s initiative within the cross-border program that will support developments in nanotechnology, a market sector of strategic importance for the future, which includes applications such as smart sensors. The Auvergne-Rhone-Alpes region, where Sofradir and ULIS have operations, announced it will contribute €35M ($40M) to support Nano 2022.
Sofradir and ULIS, whose infrared technologies are used in a range of applications from space observation and environmental monitoring to security surveillance and predictive maintenance, will invest €150M ($171M) in the Nano 2022 initiative in order to develop next-generation infrared detectors
“Infrared technologies can offer the necessary solutions for improving assisted living, mobility, energy efficiency, security and environmental monitoring, which are all crucial societal needs,” said Jean-François Delepau, chairman and CEO of Sofradir and ULIS. “As a result of our investment, equipment manufacturers will benefit from the ease-of-use and performance these new products will offer.”
Nano 2022 will enable ULIS to develop the next generations of infrared detectors to address trends in autonomous systems for smart buildings (workspace management, energy savings), road safety and in-cabin comfort of vehicles. It also enables Sofradir to develop the very large dimension infrared detectors needed for space and astronomy observations as well as compact and light sensors that can be used in portable devices and on drones. Nano 2022 contributes to the funding of the pilot lines required for developing these technologies and products.
Sofradir and ULIS participate in Nano 2022 alongside other companies based in the Auvergne-Rhone-Alpes region, including STMicroelectronics and Soitec.
The IPCEI framework develops key cross-border R&D and infrastructure projects aimed at encouraging member states to channel their public spending into large projects. These make a clear contribution to economic growth, job creation and the competitiveness of Europe. The European Commission (DGComp) evaluates the funding conditions, ensuring they are in line with EU state aid rules.