March 1998
eMail the Editor
AMD Will Offer Flash Memory in Fine-Pitch BGAs
Sunnyvale, CA-Advanced Micro Devices plans to offer selected flash memory devices in fine-pitch ball grid array CSPs. The new FBGA will occupy about one-third of the PC board space needed by standard TSOP packages, according to Walid Maghribi, group vice president of AMD's memory group.AMD's 8 Mb flash devices will be packaged in a 6 x 9 mm FBGA package with a ball pitch of 0.8 mm, while the 16 Mb flash will be slightly larger at 8 x 9 mm. The substrate-based packages will enable all AMD flash devices, regardless of density, to offer a common 0.8 mm pitch electrical footprint, making them easily interchangeable. Production lots of FBGA devices, ranging from 4 Mb to 32 Mb will begin in the fourth quarter.