The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century

Current Issue: May - June 2013

• Realizing 3D IC Integration with Face-to-Face Stacking
• Integrated Silicon Photonics Fabrication on a 300mm Platform
• Solder Joint Geometry Optimization Increases WLCSP Reliability
• Cleaning High-Reliability Assemblies with Tight Gaps
• Memory Packages Adapt to Demand Shifts
• Test Sockets for MEMS
• International Directory of Test & Burn-in Socket Suppliers

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MMM	3M Company	111.33	-0.04
AMKR	Amkor Technology	4.60	-0.65
0522.HK	ASM Pacific	90.25	1.58
EMN	Eastman Chemical	72.82	-0.46
042700.KS	HANMI Semi	8,850.00	1.84
HON	Honeywell Intl.	79.78	-0.47
NEWP	Newport Corp.	13.47	-1.97
NDSN	Nordson Corp.	73.89	-1.48
RTEC	Rudolph Tech	11.63	-2.35
ST	Sensata Tech	35.07	-4.42
SMGZY	Smiths Group PLC	20.68	-0.77
S24.SI	STATS ChipPAC Ltd.	0.41	1.23
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