The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century
Current Issue: September - October 2014
  • Suitability of Cu wire bonded ICs for automotive applications
  • Encapsulated WLCSP
  • Evolution of wafer dicing
  • Lowering the cost of MEMS
  • Die attach solutions for thin die applications
  • Reliable testing of Cu pillar technology for smart devices
  • High-reliability via interconnections in glass wafers for 2.5D
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IWLPC 2014 Gold Sponsors
CSR Advertisers Stock Index
SymbolNameLastPct
Change
MMM3M Company144.850.26
AMKRAmkor Technology9.402.57
AMATApplied Materials22.371.45
EMNEastman Chemical83.720.95
HONHoneywell Intl.94.860.22
NEWPNewport Corp.18.12-0.33
NDSNNordson Corp.79.350.15
RTECRudolph Tech9.390.00
STSensata Tech47.570.34
SMGZYSmiths Group PLC22.10-0.54

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