The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century
Current Issue: September - October 2014
  • Suitability of Cu wire bonded ICs for automotive applications
  • Encapsulated WLCSP
  • Evolution of wafer dicing
  • Lowering the cost of MEMS
  • Die attach solutions for thin die applications
  • Reliable testing of Cu pillar technology for smart devices
  • High-reliability via interconnections in glass wafers for 2.5D
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MMM3M Company160.091.12
AMKRAmkor Technology6.69-4.70
AMATApplied Materials24.050.75
EMNEastman Chemical82.92-4.43
HONHoneywell Intl.99.07-0.01
NEWPNewport Corp.17.61-1.40
NDSNNordson Corp.78.15-1.38
RTECRudolph Tech9.18-1.29
STSensata Tech49.57-0.76
SMGZYSmiths Group PLC18.02-3.79

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