The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century
Current Issue: November - December 2014
  • Automation for bond testing of MEMS
  • 3D ICs
  • Thermal management
  • PoP stacked packaging
  • High-vacuum WLP for MEMS
  • Leadless lead frame packaging
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AMKRAmkor Technology6.80-2.02
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