The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century
Current Issue: July - August 2014
  • Solder alloy trends and technologies in semiconductor packaging and assembly
  • Sapphire as a sensor platform
  • Scalable approaches for 2.5D IC assembly
  • 3D inspection challenges of copper pillar bumps
  • Cost-effective lithography for large area interposers
  • High-vacuum wafer bonding for hermetic sealing of novel MEMS devices
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IWLPC 2014 Gold Sponsors
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MMM3M Company144.13-0.26
AMKRAmkor Technology10.101.41
AMATApplied Materials22.17-0.14
EMNEastman Chemical81.34-0.79
HONHoneywell Intl.95.56-0.40
NEWPNewport Corp.19.180.63
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STSensata Tech49.64-0.24
SMGZYSmiths Group PLC21.900.69

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