The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century
Current Issue: July - August 2014
  • Solder alloy trends and technologies in semiconductor packaging and assembly
  • Sapphire as a sensor platform
  • Scalable approaches for 2.5D IC assembly
  • 3D inspection challenges of copper pillar bumps
  • Cost-effective lithography for large area interposers
  • High-vacuum wafer bonding for hermetic sealing of novel MEMS devices
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MMM3M Company145.130.31
AMKRAmkor Technology10.20-1.50
AMATApplied Materials21.76-0.66
EMNEastman Chemical87.97-0.05
HONHoneywell Intl.96.01-0.61
NEWPNewport Corp.17.26-0.23
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RTECRudolph Tech9.46-1.77
STSensata Tech47.57-0.46
SMGZYSmiths Group PLC21.58-0.25