High-end computers and electronics were once the domain of the military, other government operations and large corporations. These industries dominated the demand for semiconductor chips.

Today, according to ITRS, half of the IC revenue is derived from the consumer electronics market, which is also demanding some of the most sophisticated devices.*

Consumer products, such as cellular telephones, game consoles, etc., also tend to be portable; thus, all the components within these products must be of the smallest size, the lightest weight and offer the greatest power efficiency possible.

Smaller, lighter, faster, cheaper works best for consumer electronics.

Advancements at the front-end have achieved much of these goals, with backend packaging following close behind.

With Moore’s Law expected to eventually hit a wall, in which the front-end reaches its physical limits as to how small a transistor can become, packaging will continue to deliver beyond that barrier to shrink the physical size consumed by the electronics, and while also improving performance.

Thus, the importance of IC packaging cannot be stressed enough. Advanced new technologies, such as stacked packages and SIPs, will continue to grow in popularity.

These technologies are winning their greatest popularity in cellular telephones—a growing market in itself. It is likely that an increased number of these multi-component packages will appear in cellular phones in the future as increased functionality is incorporated into these products.

A growing number of phones are incorporating cameras. Some units, the Blackberry, for example, takes that a step further with e-mail and Internet functionality as well as other, additional tasks.

Obviously, the package mix of what is being assembled will change over time.

Material sets will also change to meet the demands of future requirements. Polyimide was once a much sought-after substrate due to its being thin and lightweight with the ability to support fine traces.

The Blackberry 8700 (Research in Motion)

Today BT resin has consumed much of that market with the invention of the microvia to create fine via holes. In addition, BT resin offers better signal propagation in relation to polyimide, with a low-loss dielectric constant.

Interconnection methods are also changing, moving more towards flip-chip solutions, as wire bonding taps out for certain markets. The result is a shortage of substrates that accommodate flip-chip connections. The latest push in interconnection styles for stacked packages and SIP solutions is for 3D interconnection styles that involve through-silicon vias.

We all know that RoHS is bringing about changes in material sets. Since lead and halogens will be eliminated in electronics sold in European markets, this will dictate changes in the mold compound, plating finishes, leadframes, solder paste, PWB finishes, etc.

Since matte tin is the leading lead-free, post-plate leadframe finish, leadframes that have less propensity to cause whiskering will be in further demand in the future. Lead-frames with a preplated finish, such as Ni/Pd/Au, are increasing in demand.

This all adds up to a world of change. As the saying goes, the only thing that is constant is change.

* Dr. Bill Bottoms, “The 2005 ITRS Assembly and Pack-aging Roadmap,”, March 2006, IEEE/CPMT meeting.