Chip Scale Review Magazine

Archives >> July 2003 issue

July 2003

Chip Scale Review is produced for a worldwide audience of engineers, specialists, researchers and end-users of chip-scale and wafer-level back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip and wafer-level packaging market with a thoroughness unmatched by any other magazine.

Featured Articles

• Is Wafer-Level Bumping Ready for Prime Time?

• International Directory of Wafer-Bumping Service Providers

• Steppers Battle Aligners for the Hearts and Cash of Wafer-Bumping Providers

• How Machine Suppliers View the Market

• RF System-in-Package: Tradeoffs Govern the Cost, Size and Performance Equation

• How Final Test Impacts the Assembly Line

• Emerging Packaging Technologies Offer Many Design Advantages for High-Speed Connections

• Why Mark Wafers, Chips and Packages At All?

• International Directory of Marking Equipment Providers

Table of Contents

• Publisher's Letter: We Shall Overcome!

• Assembly Lines: There's No Business Like Show Business: NEPCON West Finishes a 37-Year Run

• Trendlines: Talking about a Silly Little Millimeter

• Wafer-Level Watch: Play It Again, Sam! SiP Takes MCM's Role

• Electronic Trends: SiPs Offer a True Alternative to Complexity of SoC Designs

• Standards: MRT Reflow Conditions for Lead-Free Packages Challenge Standards Group

• Harvey Miller's Notebook: Lead-Free vs. Halogen-Free Electronics

• On Test: What is the Real Cost of Test

• Industry News

• Calendar

• Tools & Technologies

• Engineer's Bookshelf: Tactics for Successful IC Outsourcing

• The View From Europe: Short-Range and Metro-Area Applications Reshape Traditional Optoelectronic Packaging

• Patent Review: Patent Illustrates a New Use for Old Technology - Tape Automated Bonding

• Software Review: Filemaker Pro 6 Database - It Works for Us

• Ad Index

CSR Stock Index
Symbol	Name	Last	Pct Change
ASX	Advanced Semicond	4.72	1.51
AEHR	Aehr Test Systems	0.77	0.00
AMKR	Amkor Technology	6.07	1.34
AMAT	Applied Materials	12.79	1.19
ASMI	ASM International	35.05	3.27
CSCD	Cascade Microtech	3.63	0.00
IMOSD	IMOSD	0.00	0.00
INTC	Intel Corporation	26.74	1.75
KLAC	KLA-Tencor Corpor	51.98	0.87
KLIC	Kulicke and Soffa	11.63	2.11
LRCX	Lam Research Corp	44.19	-0.72
NEWP	Newport Corporati	19.49	2.31
NDSN	Nordson Corporati	47.90	3.03
QCOM	QUALCOMM Incorpor	61.06	0.54
RTEC	Rudolph Technolog	10.83	1.21
ST	Sensata Technolog	31.00	1.74
SPIL	Siliconware Preci	5.47	-0.91
STM	STMicroelectronic	7.01	0.29
TGAL	Tegal Corporation	3.12	0.00
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