The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century

September - October 2013
Chip Scale Review is produced for a worldwide audience of engineers, specialists, researchers and end-users of chip-scale and wafer-level back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip and wafer-level packaging market with a thoroughness unmatched by any other magazine.
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IWLPC 2014 Gold Sponsors
CSR Advertisers Stock Index
SymbolNameLastPct
Change
MMM3M Company144.600.84
AMKRAmkor Technology9.861.75
AMATApplied Materials21.89-0.73
EMNEastman Chemical82.020.56
HONHoneywell Intl.95.771.11
NEWPNewport Corp.18.800.64
NDSNNordson Corp.79.800.20
RTECRudolph Tech9.62-0.62
STSensata Tech49.630.83
SMGZYSmiths Group PLC21.71-0.27

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