The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century

September - October 2013
Chip Scale Review is produced for a worldwide audience of engineers, specialists, researchers and end-users of chip-scale and wafer-level back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip and wafer-level packaging market with a thoroughness unmatched by any other magazine.
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MMM3M Company145.12-0.01
AMKRAmkor Technology9.79-3.97
AMATApplied Materials21.23-2.41
EMNEastman Chemical88.710.84
HONHoneywell Intl.95.76-0.26
NEWPNewport Corp.17.491.33
NDSNNordson Corp.78.21-0.20
RTECRudolph Tech9.13-3.49
STSensata Tech47.41-0.34
SMGZYSmiths Group PLC21.620.21