The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century

September - October 2013
Chip Scale Review is produced for a worldwide audience of engineers, specialists, researchers and end-users of chip-scale and wafer-level back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip and wafer-level packaging market with a thoroughness unmatched by any other magazine.
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IWLPC 2014 Gold Sponsors
CSR Advertisers Stock Index
SymbolNameLastPct
Change
MMM3M Company137.22-0.13
AMKRAmkor Technology6.931.32
AMATApplied Materials20.080.98
EMNEastman Chemical75.230.12
HONHoneywell Intl.89.49-0.63
NEWPNewport Corp.17.351.17
NDSNNordson Corp.70.320.29
RTECRudolph Tech8.701.52
STSensata Tech44.080.85
SMGZYSmiths Group PLC19.190.21

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