2002 Chip Scale Review Editorial Calendar

January - December 2002

Click here to download a PDF version of the 2002 Calendar.

Issue/Mail

 

Issue Emphasis

 

Editor's Reports

 

Vendor Directory

 

Tutorial

 

Special Features

 

Technology Watch

 

Show
Distribution

 

Adv. Close Space

 

January/February

 

Mail:
Dec. 31, 2001

Equipment and Materials for Dispensing, Underfill and Encapsulation 2002 Packaging Industry Forecast

Trends in Automated Dispensing Equipment

Automated Dispensing Systems Stencil Printers and Printing Korea's Semiconductor Equipment Industry;

Copper Wafer Metallization for Wire Bonding and Flip-Chip;

The Experts: Industry Analysts Forecast the Year Ahead.

Plasma Etching, Adhesives, Wafer Backgrinding
  • APEX
    January 22-24
    San Diego Calif.
  • SEMICON Korea
    February 5-7
    Seoul
Nov. 20 (space)
Nov. 27 (materials)

March

 

Mail:
Feb. 28, 2002

Opto-Electronics Packaging Opto-Electronics

GaAs and InP Packaging Challenges

Specialists in Opto-Electronics Packaging MEMS and MOEMS China: Asia's New IC Packaging Center;

IC Packaging's 10 Biggest Productivity Killers;

The Experts: No Lead, Less Lead, More Lead or New Lead? Addressing the Controversy

Advances in HDI Microvias;

Lasers in IC Packaging

  • Optical Fiber Communication Conference and Exhibit
    Mar 19-21
    Anahiem Calif
Jan. 21 (space)
Jan. 28 (materials)

April

 

Mail:
Mar. 29, 2002

Final Test

The Experts: Test Platform Standards and Other Urban Legends

 Test and Burn-In Sockets

What You Always Wanted To Know About Final Test but Where Afraid To Ask

Test and Burn-In Sockets Memory Test CSPs in Europe: The Next Generation;

The Experts: Test Platform Standards and Other Urban Legends

Bluetooth Testing;

Probers and Probing

  • SEMICON Europa
    April 16-18
    Munich, Germany
Feb. 21 (space)
Feb. 28 (materials)

May/June

 

Mail:
May 1, 2002

Annual IC Packaging Foundry Issue

Reliability Testing

IC Packaging Foundries;

The Never-Ending Search for the Perfect Package

Annual Directory of IC Packaging Foundries Reliability Testing

Burn-In, Fine/Gross Leak, etc.

Singapore's Semiconductor Assembly Industry Materials and Methods for Packing and Shipping ICs;
Molding Equipment and Molding Compounds
  • SEMICON
    May 7-9
    Singapore
  • ECTC
    May 29-31
    San Diego Calif.
Mar. 21 (space)
Mar. 28 (materials)

July

 

Mail:
Jun. 28, 2002

Bumping, Flip-Chips and Wafer-Level Packaging Wafer Bumping and Redistribution;

New Strategies for Testing at the Wafer Level

Wafer Bumping Service Providers Photolithography for Wafer-Level Packaging Dateline USA: Will Wafer-Level Packaging Spark a New Onshore Renaissance? IC Package Design Software;

Stacked Packages, SiP, SoC, and Other Leading-Edge Formats

  • SEMICON West
    July 17-19
    San Jose Calif.
May 221 (space)
May 28 (materials)

August/September

 

Mail:
Jul. 31, 2002

IC Assembly Equipment Singulation;

Die Attach Equipment;

Wire Bonding Tools;

Wafer Mapping

Singulation Equipment Providers Singulation Equipment How Low-k Materials Will Impact IC Packaging Why Bad Things Happen to Known-Good Die
  • SEMICON Taiwan
    Dates Pending.
Jun. 21 (space)
Jun. 28 (materials)

October

 

Mail:
Sep. 30, 2002

Burn-In, Test & Inspection;Reliability Testing Packaging Marking;

Die Sorting Equipment;

Socket Update;

X-Ray Inspection Trends;

Acoustic Inspection

Cleaning Systems;

X-Ray Inspection Systems and Acoustic Inspection Systems

Automated Optical Inspection Taiwan: How a Small Island Nation Became a Semiconductor Giant Tape & Reel Systems;

Wafer Mapping

  • Fabless Semiconductor Association
    Dates Pending
    Santa Clara Calif.
  • ITC
    October 8-10
    Baltimore
Aug. 21 (space)
Aug. 28 (materials)

November

Mail:
Oct. 31, 2002

Solder and Solder Reflow Solder Ball Placement Equipment Trends;

A Controversy Revisited: What's Next for Solder?;

Salary Survey of IC Packaging Engineers

Solder Ball Placement Equipment Solder Reflow Status Report on CSPs in Japan Substrate Materials for IC Packaging;

Temperature Profiling

  • SEMICON Japan
    Dates Pending
Sep. 20 (space)
Sep. 27 (materials)

December

Mail:
Nov. 28, 2002

Annual Reference Guide to Equipment, Services and Suppliers The Year in Review Updated and revised vendor directories from the Past eight issues IC Package Design
  • APEX 2003
    San Diego
Oct. 20 (space)
Oct. 27 (materials)

*Dates to be determined
 Note: Due to circumstances beyond our control, topics, mailing dates and distribution are subject to change without notice.


© 2001 Chip Scale Review