Northbrook, Ill.-IPC's APEX conference, March 12-16 at the Long Beach, Calif., Convention Center, will present 16 tutorial sessions. The tutorials will be held from 8:30 a.m. to 4 p.m. on March 12 and will address the spectrum of electronics assembly-from the basics of SMT to advanced packaging materials.
Scheduled tutorials include: For more information contact John Riley, IPC's director of education at johnriley@ipc.org. [apex2000.org]
IEEE Burn-In and Test Sockets Workshop Slated for Arizona Mesa, Ariz.-The IEEE and IEEE Computer Society will present a workshop on burn-in and test sockets (BiTS) on February 27-29 at the Mesa Hilton Hotel. The general chair is Frederick Taber of IBM Microelectronics, Hopewell Junction, N.Y. taber@us.ibm.com. [http://members.xoom.com/bitsworkshop/]
NEPCON West 2000 Features New TAC Line, Special Events Anaheim, Calif.-NEPCON West 2000, scheduled for February 29 through March 2 will feature an all-new Technology Advancement Center processing line and more than 700 exhibiting companies, according to sponsor Reed Exhibition Companies. This year's conference will include the return of PCMCIA card assembly and chip-scale packaging in a fully-automated assembly line on the exhibit floor. More than 100 in-depth conference sessions, conducted by experts in seven technology tracks, will be presented. The tracks are, assembly, contract manufacturing, design, high-density interconnect, management, packaging and test and inspection. Former astronaut Buzz Aldrin will present the
industry keynote address, "From the Moon to the Next Millennium,"
on March 1. For more information contact NEPCON customer service
at inquiry@nepcon.reedexpo.com.
[nepcon.com]
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