An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics January - February 2000 Email the editor

New HP Test System Targets RDRAM

Hewlett-Packard has introduced a 32-site RDRAM production test system, which builds on the company's 16-site HP 95000 HSM Series test system introduced last year.

The 32-site system "delivers a risk-free path from the 16-site systems currently installed in Asia and the U.S." according to the company. The 32-site system employs the same electronics as the 16-site system, enabling customers to add electronics, thereby preserving their investment and reducing the need to evaluate an entirely new system, HP says. Figure1. HP's 95000 32-site RDRAM test system.

New pricing for volume customers will lower the cost of test by 20-30 percent, according to HP.

Hewlett-Packard Co., Test and Measurement Organization, 5301 Stevens Creek Blvd., MS 54LAK, Santa Clara, CA 95052, 800.452.4844.

[hp.com]

Loctite Intros Reworkable Underfill

Loctite has introduced what it claims is the first commercially available reworkable underfill for use on flip-chip, BGA and CSP assemblies.

Designated Loctite 3567, the product is designed to provide processing and reliability similar to conventional thermoset underÞlls with the added advantage of reworkability.

The introduction of Loctite 3567 will allow a ßip-chip to be replaced after testing determines that the chip is defective and will minimize incidents where the entire board must be discarded.

The Loctite product is an epoxy-based liquid and is compatible with polyimide-passivated ßip-chip, CSP and BGA assemblies. The adhesive cures in 5 to 15 minutes when exposed to 150 to 165^oC temperatures.

Loctite, 1001 Trout Brook Crossing, Rocky Hill, CT 06067, 860.571.5100, fax 860.571.5465.

[loctite.com]

Viscom USA Announces New AOI Systems

Viscom USA has introduced its VPS 6054 family of next generation AOI systems for circuit board inspection.

The 6054 series features a high-performance sensor unit with up to 16 CCD cameras, LED illumination units with various spectrum ranges and highly dynamic synchronous linear drives. Optional high-resolution cameras with 1300 x 1025 pixel resolution are also available.

The 6054 series includes the VPS 6054 basic version and the VPS 6054-2 double testing system.

The VPS 6054-2 combines two independent testing systems to meet extremely high cycling time requirements while occupying the same footprint as a single system.

Viscom USA, 3290 Green Pointe Parkway, Suite 400, Atlanta, GA 30092, 678.966.9835, fax 678.966.9828.

[viscomusa.com]

Conceptronic Inc. Debuts Profile Oven Series with "Dynamic Flow Engineering"

Conceptronic Inc. has developed the Profile series of reßow ovens, featuring the company's "Dynamic Flow Engineering" for better thermal performance, filterless ßux management and gas-to-gas cooling modules.

The Profile series offers the heating chambers with the highest linear convection ratio in the industry, according to the company.

Conceptronic says the multi-port design of the plenum ensures even distribution of gas velocity within each heating zone.

The serpentine ßow of gas through the oven, from blower to board to the next blower moves the gas along the length of the oven to the cooling units, where ßux can be easily cleaned out.

Conceptronic Inc., 6 Post Rd., Portsmouth, NH 03801, 603.431.6262, fax 603.431.3303.

[conceptronic.com]

Compaq Offers TAP "InSight" Software

Compaq Computer Corp.is offering hardware/software application packages for semiconductor test, assembly and packaging.

The systems are based on Camstar's Windows NT-based InSite software using Compaq's Business Bus applications framework and Microsoft's SQL Server database.

[compaq.com]

Emulation Technology Debuts BGA Adapter

Emulation Technology has introduced a 1.00 mm ball grid array prototyping adapter which enables designers to add 1.00 mm pitch BGAs to their prototype breadboards. The BGA prototyping adapter employs a zero insertion force socket, which enables multiple chip testing up to 10,000 insertions. Figure2. Emulation Technologies' BGA prototyping adapter.

Using the BGA prototyping adapter, designers will be able to remove a problem BGA component from the production board, install the component in ET's BGA adapter and test the component outside the circuit. This is accomplished by attaching the test equipment to the prototyping adapter.

Since the adapter is the same configuration as the BGA package footprint, trace lengths and adapter height are minimized, resulting in high-speed performance.

Pricing for the 1.00 mm BGA prototyping adapter starts at $795 with delivery from stock up to 10 days.

Emulation Technologies Inc., 2344 Walsh Ave., Bldg. F, Santa Clara, CA 95051, 408.983.0660, fax 408.982.0664.

[emulation.com]

Suss Launches Flip-Chip Bonder

The Fraunhofer Institute, Berlin, Germany, has taken delivery of the first SUSS FC250 flip-chip bonder.

The FC250 is based on the SUSS FC150 production ßip-chip bonder, with accuracy routinely achieving 1 micron, according to the company.

[suss.com]