Media Kit
For advertisements and demographics
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Current Advertisers
 Publisher's Letter
A Look Forward to the Year Ahead

 Assembly Lines
Pantronix Continues Expansion with Facility Planned for Shanghai, China

 Wafer Level Watch
The Allure of Parallel Processing: Defects Are Found Earlier, More Easily

 Harvey Miller's Notebook
Innovex and Substrate Technologies' Goal: Make Form Fit Function

 On Test

Credentials for Testing Are Escalating; Enter the Certified Smart Person (CSP)

 Flip-Chip Focus
Issues in Reworkable Underfills for Low-Cost Flip-Chip Applications

 Industry News
Company News
Research Reports
Packaging Foundries
People in the News
FSA 6th Annual Suppliers Day
Calendar of Events
Editorial Index

 Features
Forecast 2001
The Experts Look at the Issues

Demands for Higher Speed and Greater Accuracy Are Driving the Die Placement Equipment Market

Die Attach Equipment: What Packaging Foundries Want

CSPs Present New Challenges for Die Attach Equipment

How Bluetooth Packaging Choices Impact System Cost

Achieving High Accuracy and High-Throughput Assembly with Flip-Chip-on-Flex

Web-Based Collaborative IC Package Design

 Tutorial
An Overview of Flexible Printed Circuit Technology

 Technical Forum
How New Developments in Hydrofluorocarbon Cleaning Technology Impact Flip-Chip Package Production
Effects of Pb Contamination on the Material Properties of Sn/Ag/Cu Solder

 Tools & Technologies
Tray Changer Hikes Placement Productivity and more...

 Opinion
Something's Rotten in Stockholm: The Nobel Prize Committee and the IC

 Patents
Micro-Machined Wafer-Level Package Employs a Memory Wafer with a Silicon Nitride, SiO2 or SOG Passive Layer

 Archives
2001
Jan-Feb March April
May-June July  
2000
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1999
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1998
  Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec


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This month issue
An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics
January - February 2001

Email the editor

Calendar of Events

Subject to space available, Chip Scale Review will list conferences of interest to the international chip-scale-electronics community without cost to the sponsor. We regret, however, that we are unable to list events sponsored by commercial organizations. Please fax or e-mail your listing at least two months prior to cover date to the editor at 209.824.2799 or chipscale@cs.com.

January

14-18

APEX 2001
(Exhibits 14-16)
Exhibit Hours: Tu 10-7; We 10-6; Th 10-3
San Diego Convention Center
IPC [apex2001.org] 877.472.4724
The second running of the APEX expo and conference, which moves south this year from Long Beach, Calif., to San Diego, boasts more than 400 exhibitors showcasing equipment, materials and services for IC and PWB assembly and test.
[apex2001info@ipc.org]

31-Feb. 2

SEMICON Korea
Seoul Convention and Exhibition Center (COEX)
SEMI [semi.org]
Contacts: Lyn Jarman, SEMI, ljarman@semi.org, 408.943.6997
H.C. Kim, SEMI, hkim@semi.org,
+82.2551.3401
With its economy showing a strong recovery after the disastrous "Asian flu" of 1997-98, SEMIÕs regional Korean show prepares to greet visitors from afar with the millennium version of this event. Last yearÕs show pulled in some 13,480 visitors from 12 countries, who viewed exhibits from 464 companies over 9,063 square feet, according to SEMI.
February

13-15

Pan Pacific Micro-electronics Symposium
(with tabletop exhibition)
Kauai Marriott, Kauai, Hawaii
SMTA [smta.org], IMAPS, ITRI, SEMI
Now in its sixth year, this event has grown steadily and attracts some 200 participants each year from 15 countries.

25-Mar. 1

EtroniX
(Exhibits Feb. 27-1 March)
Anaheim (Calif.) Convention Center
Exhibit Hours: Tu and We 10-5; Th 10-4
Cahners Electronics Group
[etronixexpo.com]
EtroniX, featuring multiple related shows under one roof, replaces the stalwart NEPCON show for the new millennium. The co-located shows now include Design Expo, e/manufacturing Expo, Microelectronics Packaging International, WESCON Spring, EvaluTech and NEPCON.

March

11-14

International Symposium on Advanced Packaging Materials
Chateau Elan, Braselton, Ga.
IMAPS [imaps.org],IEEE and CPMT

28-29

SEMICON China
China World Trade Center, Beijing
Hours: We-Th 10 a.m.-5 p.m.
SEMI [semi.org] [wzhou@semi.org]
April

18-20

HD International
Santa Clara (Calif.) Convention Center
IMAPS [imaps.org], CMP Media

24-26

SEMICON Europa
New Munich (Germany) Trade Fair Centre
SEMI [semi.org]
Kerstin Stuckey, kstuckey@semi.org

 
Copyright © 2001