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 Publisher's Letter
My APEX Perspective: Running Hot and Cold

 Assembly Lines
APEX 2001: It's Déjà Vu All Over Again

 Electronic Trends
Stacked Packages Are Becoming a High-Volume Product

 Standards
Why Are There So Many Chip-Scale Package Ball Diameters?

 Market Observer

Inventory Overhang Brings Pause to Semiconductor Assembly and Test Sector

 Harvey Miller's Notebook
Y2K Was Just Practice for the Year 2001

 CSP Automation
Bumping-Up Manufacturing Capacity Can Quickly Add to the Bottom Line

 On Test
If the Real Estate People Can Connect, Why Can't We?

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Apex 2001
Apex Photo Album
Packaging Foundries
People in the News
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 Features
Dispensing Systems: Smaller CSPs Demand New Features, Greater Automation
Automated Dispensing Equipment Suppliers

Solder Ball Placement

Solder Ball Placement Equipment Suppliers

An Expert Looks at the Issues: Alec J. Babiarz on Fluid Dispensing

 Tutorial
Dispensing: The Materials, Processes and Tools Needed To Achieve Manufacturing Success

 Technical Forum
Beyond Flip-Chip, Underfills Enhance CSP Reliability

Effects of Pb Contamination on Lead-Free Sn/Ag/Bi Solder
 Tools & Technologies
Universal Offering Fully Integrated Systems and more...

 Technology Report
The Emerging Copper Revolution Will Impact ICs with Critical Dimensions Smaller than 100 nm

 Patents
This Interposer Package's Enhanced Substrate Acts as a Decoupling Capacitor and Conditions Each Signal I/O

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Current Issue
An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics
March 2001

APEX 2001 Basks in 20 Percent Attendance Hike over Last Year

San Diego-With two successful shows under its organizational belt, IPC's SMEMA council has already started to prepare for next year's event. Calibrate your Palm Pilots for January 22-24, 2002 for exhibits, with the conference program beginning on January 20.

According to IPC, this year's show pulled in more than 6,900 attendees, a 20 percent increase over last year, with 1,900 from outside the U.S. Add the exhibitors, and the show boasted a total of 12,900 people. There were some 394 booths covering more than 168,000 square feet in the Convention Center.

THE SCENE AT APEX 2001View Engineering executives Vijay Patel, product/applications manager (approximate center of photo), and Jim Sullivan, regional sales manager (to his left) take in the crowd from their booth.
Steven J. Adamson, Asymtek Corp.'s semiconductor packaging and assembly product manager, (left) and Michael Gaston, Asymtek staff engineer, prepare to put a new machine through its paces for visitors.
Tim Adams, global marketing communications manager for Dow Corning, enjoys a rare break from booth duty.
Panasonic Factory Automation Co., Franklin Park, Ill., featured new die placement machines, solder paste printing systems and chip shooters.
Autosplice, a local company, made its presence known with a large equipment display.
 
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