Media Kit
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Current Advertisers
 Publisher's Letter
My APEX Perspective: Running Hot and Cold

 Assembly Lines
APEX 2001: It's Déjà Vu All Over Again

 Electronic Trends
Stacked Packages Are Becoming a High-Volume Product

 Standards
Why Are There So Many Chip-Scale Package Ball Diameters?

 Market Observer

Inventory Overhang Brings Pause to Semiconductor Assembly and Test Sector

 Harvey Miller's Notebook
Y2K Was Just Practice for the Year 2001

 CSP Automation
Bumping-Up Manufacturing Capacity Can Quickly Add to the Bottom Line

 On Test
If the Real Estate People Can Connect, Why Can't We?

 Industry News
Company News
Apex 2001
Apex Photo Album
Packaging Foundries
People in the News
Calendar of Events
Editorial Index

 Features
Dispensing Systems: Smaller CSPs Demand New Features, Greater Automation
Automated Dispensing Equipment Suppliers

Solder Ball Placement

Solder Ball Placement Equipment Suppliers

An Expert Looks at the Issues: Alec J. Babiarz on Fluid Dispensing

 Tutorial
Dispensing: The Materials, Processes and Tools Needed To Achieve Manufacturing Success

 Technical Forum
Beyond Flip-Chip, Underfills Enhance CSP Reliability

Effects of Pb Contamination on Lead-Free Sn/Ag/Bi Solder
 Tools & Technologies
Universal Offering Fully Integrated Systems and more...

 Technology Report
The Emerging Copper Revolution Will Impact ICs with Critical Dimensions Smaller than 100 nm

 Patents
This Interposer Package's Enhanced Substrate Acts as a Decoupling Capacitor and Conditions Each Signal I/O

 Archives
2001
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2000
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July-Aug Sept-Oct Nov-Dec
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July-Aug Sept-Oct Nov-Dec


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Current Issue
An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics
March 2001

APEX Photo Album

March Instruments of Concord, Calif., impressed visitors with its inline plasma system. From left are Melissa McCrossen of March Instruments, Gary Ingbretson of Sea-Tek, an unidentified visitor, and the company's vice president, Christa Fairfield.
Vlad Levchine (left) and Mark Roth, both with Industrial Objects Inc., Cambridge, Mass., prepare to enter the San Diego Convention Center after a lunch break.
Visitors surveyed the new reflow soldering ovens and wave soldering equipment at the large display of ERSA Inc., of Plymouth, Wis.
Steve Saito, OEM applications engineer for Loctite Canada Inc. (left) talks encapsulants with a booth visitor, while Loctite's Bruno Deveau, in the background, listens.
Mike Kaminsky (left), field application engineer for Kester Solder and Dave Torp, Kester's vice president, marketing and business development, straighten up the Kester booth.
Rick Short, marketing communications director of Indium Corp. of America (left), talks business with Gene Selven, Chip Scale Review publisher.
Eric Becker (left), mechanical engineer for Speedline's ELECTROVERT Division, Camdenton, Mo. and Eric Ludwig, reflow engineering manager at ELECTROVERT, display the company's new diode laser soldering system. Linda Woody is a staff engineer at Lockheed Martin, Ocala, Fla., which co-developed the system.
Tim Kolaczk (left), marketing specialist for ECT, and Randy Steinle, ECT's north central regional sales manager, landed booth duty at APEX.
Siemens was, as always, a crowd pleaser with its multimedia demonstrations.
Industry luminary Duane Wadsworth (right), president of Wadsworth-Pacific, Menlo Park, Calif., visits Don Place (left) and Don Campbell of SST International (formerly Scientific Sealing Inc.)
Humberto Miranda (left), manufacturing manager at Interconnect Systems Inc., Camarillo, Calif., and Tom Owens, director of process and manufacturing development for ISI review the show program.
Tina Szigetvari, at the Technomatix-Unicom booth, demonstrates a Slinky for consultant Noam Shany of Cardiff by the Sea, Calif.
PACE, of Laurel, Md., displayed its extensive line of soldering and desoldering equipment.
Samsung Technology, Horsham, Pa., was on scene with its line of odd-form placement equipment.
 
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