Media Kit
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Current Advertisers
 Publisher's Letter
My APEX Perspective: Running Hot and Cold

 Assembly Lines
APEX 2001: It's Déjà Vu All Over Again

 Electronic Trends
Stacked Packages Are Becoming a High-Volume Product

 Standards
Why Are There So Many Chip-Scale Package Ball Diameters?

 Market Observer

Inventory Overhang Brings Pause to Semiconductor Assembly and Test Sector

 Harvey Miller's Notebook
Y2K Was Just Practice for the Year 2001

 CSP Automation
Bumping-Up Manufacturing Capacity Can Quickly Add to the Bottom Line

 On Test
If the Real Estate People Can Connect, Why Can't We?

 Industry News
Company News
Apex 2001
Apex Photo Album
Packaging Foundries
People in the News
Calendar of Events
Editorial Index

 Features
Dispensing Systems: Smaller CSPs Demand New Features, Greater Automation
Automated Dispensing Equipment Suppliers

Solder Ball Placement

Solder Ball Placement Equipment Suppliers

An Expert Looks at the Issues: Alec J. Babiarz on Fluid Dispensing

 Tutorial
Dispensing: The Materials, Processes and Tools Needed To Achieve Manufacturing Success

 Technical Forum
Beyond Flip-Chip, Underfills Enhance CSP Reliability

Effects of Pb Contamination on Lead-Free Sn/Ag/Bi Solder
 Tools & Technologies
Universal Offering Fully Integrated Systems and more...

 Technology Report
The Emerging Copper Revolution Will Impact ICs with Critical Dimensions Smaller than 100 nm

 Patents
This Interposer Package's Enhanced Substrate Acts as a Decoupling Capacitor and Conditions Each Signal I/O

 Archives
2001
Jan-Feb March April
May-June July  
2000
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1999
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1998
  Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec


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Current Issue
An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics
March 2001

Calendar of Events

Subject to space available, Chip Scale Review will list conferences of interest to the international chip-scale-electronics community without cost to the sponsor. We regret, however, that we are unable to list events sponsored by commercial organizations. Please fax or e-mail your listing at least two months prior to cover date to the editor at 209.824.2799 or chipscale@cs.com.

March

11-14

International Symposium on Advanced Packaging Materials
Chateau Elan, Braselton, Ga.
IMAPS [imaps.org],
IEEE [ieee.org] and CPMT

28-29

SEMICON China
China World Trade Center, Beijing
Hours: We-Th 10 a.m.-5 p.m.
SEMI [semi.org] [wzhou@semi.org]
April

18-20

HD International
Santa Clara (Calif.) Convention Center
Exhibits: April 18, 11 a.m.-6:30 p.m.; April 19, 11 a.m.-4:30 p.m.
Conference: April 17-20
HD International opens its second annual conference and exhibition in its new Silicon Valley venue.
An opening night reception will take place on the exhibit floor Wednesday, April 18, 5:30 p.m.
IMAPS [imaps.org],
CMP Media [hd-international.com]

18-20

International Conference on Electronics Packaging (ICEP) and 15th Microelectronics Show
Tokyo Ryutsu Center
IMAPS Japan [jiep.or.jp],
JIEP, IEEE CPMT Japan Chapter [imaps-j@jiep.or.jp]

24-26

SEMICON Europa
New Munich (Germany) Trade Fair Centre
Exhibits: April 24 and 25, 10 a.m.-5 p.m.; April 26, 10 a.m.-4 p.m.
SEMI [semi.org]
Kerstin Stuckey, kstuckey@semi.org

24-26

SMT/ES & S/
Hybrid 2001
Exhibition Center Nuremberg, Germany
System Integration in Microelectronics
Hours: 9 a.m.-5 p.m.
Mesago Messe & Kongress GmbH [smt-exhibition.com]

May

8-10

SEMICON Singapore 2001
Singapore International Convention and Exhibition Centre
Singapore and the Southeast Asia region are projected to purchase nearly $2 billion in semiconductor equipment. This show, according to SEMI, has grown an average of 25% yearly since 1991 and draws more than 7,500 visitors from 25 countries.
SEMI [semi.org]

29-June 1

The 51st Electronic Components and Technology Conference (ECTC)
Wyndham Palace Resort and Spa, Lake Buena Vista (Orlando), Fla.
IEEE [ieee.org], CPMT, EIA/ECA
June

18-19

Flip Chip 2001 Conference & Exhibition
Four Seasons Hotel, Austin, Texas
With the predicted growth of the flip chip industry, IMAPS decided that a larger venue was needed for this year's program, resulting in a move from the former venue in Braselton, Ga.The technical program will continue to focus on recent advances in flip-chip technology and ways to implement them.
A focused exhibition will feature suppliers who support the industry.
IMAPS [imaps.org], Peter Elenius, General Chair [pelenius@flipchip.com]

 
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