Dow Corning Plans to Acquire Raychem Materials Business Unit Midland, Mich.-Dow Corning Corp. has signed an agreement to acquire the Raychem Power Materials Business Unit of Tyco Electronics in Menlo Park, Calif. Both companies expect the deal to be completed by the end of this quarter. The agreement calls for Dow Corning to receive the Tyco unit's fabricated thermal interface materials (TIMs), electromagnetic-interference (EMI) and radio-frequency-interference (RFI) shielding products. Dow Corning will also gain certain connector sealing products sold under the GELTEK, HEATPATH and DBSEAL trademarks. [dowcorning.com] Buettner Appointed President, COO at Radiant Technology Fullerton, Calif.-Radiant Technology Corp., a supplier of thermal processing systems, has promoted David Buettner to president and chief operating officer, reporting to Lawrence McNamee, chairman and CEO. Buettner joined RTC about one year ago as vice president of engineering and manufacturing from Aerojet, where he was director of engineering.
Polcari Tapped as President, CEO of International SEMATECH Austin, Texas-Dr. Michael R. Polcari has joined Interna-tional SEMATECH (ISMT) as president and CEO. Dr. Polcari was most recently vice president of procurement engineering for IBM Global Procurement in Somers, N.Y. As ISMT president, he will be on leave of absence from IBM. Bob Helms, who joined ISMT from Texas Instruments in July 2001, will remain with the consortium until May. Dr. Polcari holds a doctorate in solid state physics and a master's degree in physics from Stevens Institute of Technology in Hoboken, N.J. He earned a bachelor's degree in physics from the University of Notre Dame. Muranaga Named President of Yamaichi Electronics USA San Jose-Alfred Muranaga has succeeded Shinichiro Koga as president of Yamaichi Electronics USA, a producer of test and burn-in sockets. Muranaga was most recently the company's senior vice president of sales and marketing. [yeu.com]
Shipley Company Opens $30 Million Advanced Technology Center Marlborough, Mass.-Shipley Company L.L.C., a subsidiary of Rohm and Haas Co., recently opened its state-of-the-art Advanced Technology Center for developing lithography, interconnect, low-k dielectrics and other critical materials to produce the newest generations of microelectronic and related devices. The $30 million center is a bold move to deliver advanced materials capabilities to the global semiconductor market with related optoelectronic and MEMS materials. Dozens of industry leaders, customers, partners and suppliers attended the opening. "The ATC is our focal point for integrated materials development, where we will work with other Rohm and Haas companies and equipment suppliers to solve the IC industry's most complex materials science challenges," said Stephen Robinson, president of Shipley Microelectronics, a Shipley division. "We remained committed to the ATC throughout one of the bleakest economic periods in our industry's history, and the timing of our investment was not coincidental," Robinson added. "We believe that this center will be a defining element in our long-term strategy to support customers as they move into the era of sub-100nm devices," said Robinson. He added that the local high-tech infrastructure made the ATC possible. Advanced 193nm Exposure System The Class 1 cleanroom boasts an advanced 193nm exposure system and the latest track technology. Also in place is a comprehensive metrology and modeling capability with FIB and SEM systems. Designed for cleanroom expansion, another 65,000 square feet is ready when needed. Initial programs focus on fast-cycle development of new 193nm photoresists and anti-reflectant coatings. Additional programs will focus on the development and integration of low-k dielectrics, copper interconnect and later generation lithography materials supporting 157nm, extreme ultraviolet (EUV) and e-beam technologies. There will be tight links with recently acquired Haleos, a manufacturer of silicon micromachined components for optoelectronics and Rodel's chemical mechanical planarization and wafer surface preparation expertise. Shipley Ronal's high-density circuit board processes and chemistries will also support the ATC. [shipley.com] - Terry Thompson SECAP Reports Tutorial Tour Success in Six Asian Countries Last year's SECAP Tutorial Tour of East Asia was highly successful in tone and in attendance, according to Paul Siblerud of member company SEMITOOL. The SECAP consortium supports the development and adaptation of advanced packaging technologies in the semiconductor industry. During the recent tour, a total of 28 tutorial presentations were presented, although not all were given at every venue. The tour visited China, Japan, Korea, Singapore, Taiwan and Thailand. The tutorials focused on three major topics: updates on 300mm wafer processing; the latest results in lead-free solder bump materials; and specific bumping issues with MEMS/MST devices. [secap.org] ATE Maker Credence Systems Acquires Germany's SZ Testsysteme Fremont, Calif.-In January, at about the same time it closed the purchase of Optonics, a supplier of emission-based optical diagnostics and failure analysis equipment, Credence Systems picked up German-based SZ Testsysteme. Terms of the SZ Testsysteme deal were not disclosed. Credence says it paid $19 million in stock for Optonics.
SZ Testsysteme, based in Amerang, Germany, sells ATE to the analog, power, automotive and communications market. "Historically, Credence's strength has been in the SoC, mixed-signal and flash memory test markets, whereas SZ's established success has been primarily in the automotive test sector," according to a statement by Dr. Graham Siddall, Credence chairman and CEO. Credence closed its 2002 fiscal year with a net loss of $170.5 million on sales of $164.2 million. [credence.com] |
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