Media Kit
For advertisements and demographics
click here

On Line Reader Service
List of the sponsors with ChipLinks

 Publisher's Letter
Aboard the China Express

 Assembly Lines
How much semiconductor theory do you remember? That much? Really!

 Opto-Electronically Speaking 
Putting some zip in 3D wafer bonding

 Electronic Trends
Radio frequency ICs gaining; leadframe packages favored

 Standards
The leadframe CSP is the leader of the pack with 307 JEDEC variations

 Wafer-Level Watch
Still wainting for the industry recovery?

 Industry News
Company News
Opto/Nanotechnology
Packaging Foundries
People in the News
Calendar of Events
Editorial Index

 Features
Solving the Flip-Chip Puzzle: This Technology Is Poised to Grab a Large Chunk of Packaging
Die Attach, Wire Bonders and Flip-Chip Bonder Suppliers

Thermal Management Tips: If You Can't Stand the Heat, What Are You Going to Do About It?

Flip Chip on Organic Structures: A Maturing Technology that Requires Process Understanding

Optoelectronics Packaging - Building upon Integrated Circuit Manufacturing Expertise

Process Makes Electroless Nickel/Gold Wafer Bumping Economical for Flip-Chip Packaging

Leadless Plastic Packages, Such As the DFN and QFN, Have Inspired a Renaissance in a Mature Technology

 Tools & Technologies
Thermally Conductive Multiuse Adhesive and more...

 Patents
Invention describes how to form wafer-level hermetic packages

 Archives
2003
Jan-Feb March April
2002
Jan-Feb Mar-Apr May-Jun
July Aug-Sep Oct
Nov-Dec    
2001
Jan-Feb March April
May-June July Aug-Sep
October Nov-Dec  
2000
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1999
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1998
  Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec


Subscription
Free U.S. Subscription Form

 
March 2003
The International Reference for Chip-Scale Electronics, Flip-Chip Technology, Optoelectronic Interconnection and Wafer-Level Packaging
People in the News

Dr. Shastri Arrives at Palomar to Direct R&D and Engineering

Vista, Calif.-Dr. Venkat Shastri has joined Palomar Technologies as vice president of engineering from KLA-Tencor, Milpitas, Calif.

Dr. Shastri is an expert in robotics and intelligent automation and will direct Palomar's R&D efforts in high-precision assembly automation systems.

Prior to his tenure at KLA-Tencor, Dr. Shastri served five years with SRI International, Menlo Park, Calif., as senior director, engineering and product development. His scientific background includes a post as a Yale University research scientist.

He holds bachelor's and master's degrees in mechanical engineering and a doctorate in electrical engineering from the University of Massachusetts, Amherst. [bonders.com]

Dave Selestak

Selestak Given Eastern U.S. Sales Post for March Plasma

Concord, Calif.-Dave Selestak has been named eastern U.S. regional sales manager for March Plasma Systems, a Nordson division. He reports to Frank Huysmans, vice president of sales.

Selestak is a 22-year Nordson veteran, and for the past 12 years has sold capital equipment for uses in semiconductors, PC boards and electronics component markets. He will be based in Nordson offices in Amherst, Ohio. [marchplasma.com]

Trippel Named President, GM for Henkel Loctite Electronics

City of Industry, Calif.-Patrick Trippel has joined Henkel Loctite Corp. as president and GM of the company's electronics group, reporting to Heinrich Gruen, CEO of Henkel Loctite Americas.

He joined Henkel Loctite from Siemens Dematic Electronic Assembly Systems, Norcross, Ga., where he was president since 2000. [loctite.com]

Yee-Ming Ting

Ting Named President of SEMI China

San Jose-SEMI has promoted Yee-Ming Ting to president of SEMI China, headquartered in Beijing. He reports to Stanley T. Myers, SEMI president. [semi.org]

Mike S. Lee

Amkor Technology Tags Lee for Greater China President's Post

Chandler, Ariz.-Amkor Technology Inc. has named Mike S. Lee Greater China president, reporting to Bruce Freyman, vice president for product and manufacturing operations.

Lee, who will be based in Taipei, was most recently president of U.S. operations for Siliconware Inc. He is a graduate of the Chinese Military Academy in Taiwan and holds degrees in several disciplines, including physics and business administration. [amkor.com]

ASAT Inc. Appoints Ward Senior Vice President/GM

Hong Kong-Charles F.L. Ward has joined ASAT Inc., Fremont, Calif., as senior vice president/GM, reporting to Harry R. Rozakis, ASAT Holdings Ltd. CEO.

Ward, who joined ASAT from Flextronics International where he was vice president of the photonics group and advanced development, San Jose, will oversee ASAT's U.S. operations.

Prior to Flextronics, Ward served with Hyundai Electronics Inc. in the IC assembly and test division (which later became ChipPAC). He was also a director at ChipPAC, the name for Hyundai's former assembly and test division.

Ward holds a bachelor's degree in economics and political science from the University of Vermont. [asat.com]

SAC Recertifies ChipPAC and STATS

San Diego-The Semiconductor Assembly Council has recertified ChipPAC and STATS. SAC also announced that its semi-annual meeting will be held at San Jose State University. [sacouncil.org]

 
Copyright © 2003