Thermally Conductive Multiuse Adhesive Creative Materials Inc., Tyngsboro, Mass., has released 122-33(SD), a 100 percent, syringe-dispensable, thermally conductive epoxy die attach adhesive. In addition to die attach, suitable applications include PC board fabrication, advanced material composites, sealing and high-performance coatings. [creativematerials.com]
Low-Cost Production Tester for Laser Diodes Royce Instruments of Napa, Calif. has announced the P35 L-I-V production laser diode tester. The unit provides extensive test of individual edge-emitting lasers during the normal process step of die removal from tape. The company claims several advantages for testing during die removal from tape. Since GaAs and INp are very fragile materials, yield loss during handling can be costly. In the past, according to Royce, diodes have usually been tested only after bonding to costly gold-plated packages. This system makes in-process laser die testing practical. [royceinstruments.com]
Solder Ball Placement for Substrates, Wafers DEK of Weymouth, U.K., has introduced the "micron-class" Galaxy platform for IC packaging and next-generation SMT assembly with remote, real-time machine management. The platform is capable of placement of 0.3mm diameter solder balls in area grid arrays for CSPs at the substrate and wafer levels. Software adds automated communications to enhance machine maintenance. [dek.com]
Indicator Tape Provides Water Damage Evidence 3M of Austin, Texas, has released Water Contact Indicator Tape 5557, which provides clear evidence of water damage. When water contacts the edges of this tape, it changes color permanently from white to red. In electronic modules or products, the red color indicates water contact without false identification from high humidity. [3m.com/eadhesives] Shellcase, Israel, Selects EV Group for Equipment EV Group, Scharding, Austria, says Shellcase, Jerusalem, Israel, a provider of CSP services, has finalized an equipment purchase agreement for EV Group equipment. The purchase includes the EVG640 bond aligner and EVG520 semi-automated wafer bonding system, designed for production use with wafers as large as 200mm. [evgroup.at] [shellcase.com] National SEMI Installs NEXX' Nimbus System NEXX Systems of Wilmington, Del., says that National Semiconductor in Melaka, Malaysia has installed its Nimbus 310 sputter deposition system. The unit will be employed for under-bump metallization in a flip-chip process. The system, according to NEXX Systems, was installed and operational in less than two weeks. [nexxsystems.com]
In-Line Stencil Printers Offer Ease of Use EKRA of Beonnigheim, Germany, has introduced the X5HSP and E5-36 in-line screen printers to the North American market. The X5 is supplied with a proprietary vision system and two CCD cameras as standard. The company has also added the E5-36 printer to its E5 series on in-line printers. The unit claims to offer the largest board size capability available at 915mm x 610mm for a in-line system. The EKRA vision alignment system with software controlled variable lighting is included. [ekra.com] Honeywell Granted Phase Change Patent Honeywell's Electronic Materials business, Sunnyvale, Calif., has been granted U.S. Patent 6,451,422, on PCM45, a phase change thermal interface material which employs a novel polymer and conductive filler system. [honeywell.com]
Die Bonder Suitable for Flip-Chip Assembly Tresky Corp., of Morganville, N.J., a subsidiary of Dr. Tresky AG, has announced the semi-automated T-3200 series of die bonders-bar mounters/stackers, featuring a placement accuracy of ±1 micron. The series is suitable for mounting flip chips, edge-emitting laser diodes, laser bars/ arrays, VCSELs and other opto components. A patented die ejector handles devices, including bars, from 0.2mm x 20mm and very large devices with a side length of 50mm. Devices can be attached to substrates or placed in waffle or Gel-Packs. [tresky.com]
Signal Probe Socket for Embedded Systems SER Electronics USA, Pleasant Hill, Calif., has introduced the solderless Signal Probe Socket FFP1152-S2-II. The socket is aimed at PLD/ FPGA engineers and embedded system developers. The product is a joint development of SER Corp., Japan, and SK Electronics, and combines the former's "Super Micro Contact Technology" with SK's advanced process wiring technology. Initial availability is for the Xilinx FPGA Virtex-IIFF1152 semiconductor device. [serusa.com] |
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