March 1998 eMail the Editor

Features Encapsulation Trends: Pushing the Envelope for the Next Generation of CSPs By Ron Iscoff, Editor Chip-scale packages are helping to define the next level of sophistication in encapsulant materials, processes and systems. Polymers for encapsulation: Materials Processes and Reliability By Prof. C.P. Wong, Georgia Institute of Technology Today'S Complex Circuits Require Encapsulants That Do More Than Simply Protect The Device Inside The Package. Technical Forum Recent Advances in CSP Encapsulation By Craig Mitchell, Tessera Inc. New Molding Compound Enables Higher Assembly Throughput By M. Shinahara, Ciba Specialty Chemicals