March - April 1999
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ChipCooler's Polymer Expands Thermal Limits
A new polymer developed by ChipCoolers Inc. is claimed to more than double the thermal conductance of polymer composites now on the market.The new product, Cool Poly®, is currently in beta test, according to Kevin McCullough, engineering manager.
Claimed benefits are:
- Lower manufacturing costs
- Moldable, allowing for complex geometries to improve optional h performance
- Reduction in size or complete elimination of fans
- Less stress on portable computer batteries
- Over 1/3d lighter weight than aluminum