March - April 1999
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Electroless Bumping Meets Customers' Cost Targets
Pac Tech GmbH has opened Europe's first subcontract bumping facility, focusing on European requirements of smart cards, smart labels and automative microelectronics.The bumping process is based on an electoless Ni/Au under bump metallization (UBM) and solder application by stencil printing on the wafer level. This enables a "significant cost reduction," according to the company.
Pac Tech GmbH, Am Schlangenhorst 15-17, 14641 Nauen, Germany, +49.3321.4495, fax +49.3321.4495.23.
www.pactech.de