March - April 1999 - ChipScale Review

March - April 1999


eMail the Editor

Socket Sources for Chip-Scale Packages

Vendor Technology Contact Phone Test Burn-in
3M Micro-mech ZIF, elastomeric, flex interposer Michael Darlington
Monty Van Dover
512-984-3493
512-984-3492
Y Y
Aehr Bump on flex See-Hack Foo 650-691-9400 Y Y
AQL Particle Interconnect or pogo-pin Doug Kocher 503-682-3193 Y N
Enplas Tesco Open-top micro-ZIF Solomone Taufa 408-749-8124 x313 Y Y
EPI Conductive polymer bumps (licensed technology) John Pierce
Bob Korte (rep)
972-398-5518
408-534-4285
Y Y
E-tec Patent spring contact Bud Kundich (rep) 408-746-2800 Y
Johnstech Elastomer supported rigid contacts Ray Egan 612-378-2020 Y N
JSR Pressure sensitive conductive rubber (source of material) Mary Burkhart 408-543-8900 Y Y
Liberty Research Shin-Etsu wire-in-elastomer or 3M mat'l Nick Langston 408-727-5980 Y Y
Loranger Patent spring, other Al Loranger, III 814-723-2250 Y Y
NHK Miniature pogo-pins (0.25 mm pitch) Kaz Matsushima 408-492-9374 Y Y
Oz Tek Miniature pogo-pins (0.5 mm pitch) Bruce Rogers 510-782-2654 Y N
Plastronics Elastomeric interposer and ZIF sockets David Pfaff 972-258-2580 N Y
Prime Yield Shin-Etsu w/contact array (0.5 mm pitch) Mark Godfrey
Jim Brandes
612-407-7777 Y Y
Rika Denshi Double-ended spring probes (0.5 mm pitch) Ron Mendler
Eric Nathan
508-226-2080 Y Y
Shin-Etsu Gold wire matrix in elastomer (source of material) Nobuki Kumazawa 510-475-9000 x326 Y
Synergetix Miniature spring probes (0.5 mm pitch) Kevin Koontz 913-342-0404 Y Y
Tecknit Fuzz-button and Hard-Hat Rick Mellert 908-272-5500 x268 Y N
Tessera Shin-Etsu and interposer on PGA Elliott Pflughaupt 408-383-3658 Y N
TI Die Mate w/Particle Interconnect or dual-beam style ZIF Peter Manos 732-321-3789. Y Y
Wano-Tech Micro-spring pins and miniature pogo-pins Miki Sugitani 650-372-2780 Y Y
Wells-CTI Packard-Hughes interconnect or 'Y' contact Kurt Kaashoek
Tom Sloan
602-581-5330
408-452-4290
Y Y
Yamaichi Mechanical actuator micro-ZIF, lateral ball contact Frank Lessani 408-456-0797 x156 Y Y

* Tessera does not endorse or recommend any of the listed equipment or material suppliers. Manufacturers must make their own determination as to the suitability of using equipment or materials from any particular supplier. (Courtesy of Elliott Pflughaupt, Tessera)



Chip Scale Review o 7291 Coronado Drive, Suite 8 o San Jose, CA 95129 o Email: editor@chipscalereview.com



SideBar, 6/3/99, 99/06/04, ID=9903/sockets2
Keywords=at00

© 1998 ChipScale REVIEW