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 Publisher's Letter
Everybody Talks About Customer Service

 Assembly Lines
The MQUAD Package Is a Survivor, but Its Future Is Still Cloudy

 Wafer-Level Watch
Packaging Will Fuel the Productivity Engine of the Future

 Harvey Miller's Notebook
'Irrational Exuberance' Ended in 2000 - for Awhile, at Least

 Industry News
EtroniX Brings Rain but Few Smiles in Anaheim; NEPCON Replacement Struggles for an Identity
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Company News
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Packaging Foundries
Calendar of Events
Editorial Index

 Features
Testing Integrated RF Devices: Keeping Ahead of the Technology Curve
The Squeeze Is On! Designing Sockets for Next-Generation IC Packages

Socket Vendors

An Expert Looks at the Issues: Paul Sakamoto On Final Test

Special Report: CSPs in Europe - A New Attitude

 Tutorial
Burn-in Sockets for Chip-Scale Packages

 Technical Forum
How Heat Sink Size, Ambient Air Temperature and Air Velocity Affect IC Burn-in

Solder Joint Stress in a Cavity-Up, Flex Based BGA

Effects of Pb Contamination on the Material Properties of Lead-Free Sn/Ag/Cu/Sb Solder
 Tools & Technologies
Phoenix Intros 3D X-Ray Inspection System and more...

 Patents
This Simple Wafer-Level Package Offers High Reliability at Low Cost

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Current Issue
An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics
April 2001
Socket Vendor Table

SOCKET VENDORS
Issue advertisers are shown in boldface type. The information furnished below and on the following page has been supplied by the manufacturers, and Chip Scale Review makes no warranty as to its accuracy.
Company Name
Address
Phone
[website]
Model
Introduced
I/O Range
Contact Pitch (mm)
Technology
Inductance (nH)
Typical Insertions
Applications
Packages Accomodated
Handlers Accomodated
Contact
e-mail

Additional Offices
Aehr Test Systems
400 Kato Terrace, Fremont, CA 94539
Phone: 510.623.9400
DiePak
1995
1-320+
N/A
Membrane probe
Not supplied
150-300K
Burn-in, test
56, 108, 172, 320 lead DiePaks
Not model specific
Martin Hemmerling
mhemmerl@aehr.com
Aries Electronics Inc.
62A Trenton Ave.,
Frenchtown, NJ 08825
Phone: 908.996.6841
[arieselec.com]
High Performance RF Test Socket
Jan 1997
2-208
0.4-5.08
Microstrip contact
0.01
500K
Prototype, test
Most surface mount, consult manuf.
Most handlers, consult manuf.
Frank Folmsbee,
Sales & Marketing Manager
info@arieselec.com
DCI (Division of Credence Systems)
3350 Scott Blvd., Bldg. 58,
Santa Clara, CA 95054
Phone: 408.988.6800
[dci-us.com]
Rambus Quad SerDes Test Socket
Jan 2001
44-256
1.0
Conformable polymer contacts
~200 10K
Characterization, prototype
BGA, LGA
Not a production socket
Nick Langston,
Product Line Manager
nicksr@dci-us.com
Phone: 408.988.6800 x13
ECT (Everett Charles Technologies,
Semiconductor Group)
4837 White Bear Pkwy.,
St. Paul, MN 55110
Phone: 651.407.7777
[ectinfo.com]
BantamPak
1999
Up to 1156
0.5-1.27
Bantam probe
.8-1.3 1 Million
Test
BGA, CSP, LGA, PGA
Most handlers, consult manuf.
Kathy Tilley,
Senior Marketing Specialist
µHPC/GA
1996
Up to 1300
0.5-1.27
Elastomer
.6-1.1 200K+
Test
BGA, LGA, PGA
Most handlers, consult manuf.
Enplas Tesco Inc.
(formerly Tesco International)
765 N. Mary Ave.,
Sunnyvale, CA 94085
Phone: 408.749.8124
[enplas.com]
LGA-1936-1.0
Dec 2000
1936 Leads
1.0
Compression mount
5~6 10K
Burn-in, test
LGA
Manual loading
Byron Brooks,
National Sales Manager
BGA-1936-1.0
Dec 2000
1936 Leads
1.0
Compresion mount
5~6 10K
Burn-in, test
BGA
Manual loading
E-tec Interconnect Ltd.
Industrial Zone C, CH 1072 Forel (Lavaux), Switzerland
Phone: +41.21.781.08.10
[e-tec.ch]
BxW/LxW
(Screw Lock)
1995 2000+
0.75-1.50
Spring contact
<5 1000
Burn-in, test
BGA, CSP, LGA
Not adapted to handlers
Chris Haffter
info@e-tec.ch

U.S. Representative:
Bud Kundich
Phone: 408.746.2800
mailbox@kundich.com
BxK/LxK
(KnoPhone: Lock)
1998 2000+
0.75-1.50
Spring contact
<5 1000
Burn-in, test
BGA, CSP, LGA
Not adapted to handlers
BxP/LxP
(Solderless Compression)
1998 2000+
0.75-1.50
Spring contact
<5 1000
Burn-in, test
BGA, CSP, LGA
Not adapted to handlers
High Performance Test Inc.
4408 B Enterprise Place,
Fremont, CA 04538
Phone: 510.445.1182
[hptestusa.com]
Pogo Pin Test Socket
1996
No limit
Up to 0.4
Spring probes
Consult manuf.
Consult manuf.
Automated test, burn-in, hand test, prototype
All package types
All handlers
Mark Malfatti
mmalfatti@hptestusa.com
Ironwood Electronics Inc.
990 Lone Oak Rd., Eagan, MN 55121
Phone: 651.905.7907
[ironwoodelectronics.com]
GHzBGA Socket Family
March 2000
36-676
Down to 0.5
Conductive elastomer
<1
2-100K
High-performance, Prototype
BGA, custom designs
Customizable to any handler
Gary Forsberg,
Director of Sales
garyf@ironwoodelectronics.com
Kulicke & Soffa (Cerprobe Division)
1150 N. Fiesta Blvd., Gilbert AZ 85233
Phone: 1.877.333.2772
[kns.com]
Delta Flex-Compatible CSP Test Contactor
July 1999
Any range
0.5-1.27
Spring probes
0.58 (Lowest available)
>100K
Auto test, hand test
BGA, CSP, FBGA
Can be configured to most
info@cerprobe.com
Johnstech International Corp.
1210 New Brighton Blvd.,
Minneapolis,MN 55413
Phone: 612.378.2020
[johnstech.com]
Various Models
1991
2-1800 (Ball Series)
0.4-1.27
Rigid contact
Down to 0.15
1 Million+
Burn-in, prototype, test, etc.
BGA, CSP, LCC, MLF, QFP, SO
Most handlers, consult manuf.
info@johnstech.com

2450 Scott Blvd., Ste. 305, Santa Clara, CA 95050
Johnstech Interconnect Ltd.
1-2 Usk St., Newport, NP19 7BE, South Wales, UK
Loranger International Corp.
817 Fourth Ave., Warren, PA 16365
Phone: 814.723.2250
[loranger.com]
ClamShell and OpenTop 450SQ1368 Family
Nov 2000
8-1417+
0.5-1.27
Patented Micro Contact
1-8
50K
Burn-in, test
BGA, CSP, LGA requiring temperature control
Most with Guideplate adapter kit
Chris Haffter
info@e-tec.ch

U.S. Representative:
Bud Kundich
Phone: 408.746.2800
mailbox@kundich.com
ClamShell 07063044
Dec 2000
8-100+
0.5-0.8
Patented Micro Contact
1-8
50K
Burn-in, test
Optical BGA, Optical CSP
Most with Guideplate adapter kit
Plastronics Socket Co.
2601 Texas Dr., Irving, TX
Phone: 972.258.2580
[plastronicsusa.com]
QFN
May 2000
4-100
0.4-1.0
Stamped contact
~3
5K (Burn-in minimum)
Burn-in, prototype, test
Amkor LPCC, MLF, QFN and similar
Not handler specific
David Pfaff
Phone: 972.258.2580
R2 QFN
July 2000
64-240
0.4-0.8
Stamped contact
~3
5K (Burn-in minimum)
Burn-in, prototype, test
QFP, TQFP
Not handler specific
Synergetix
(Division of IDI, Interconnect Devices Inc.)
310 S. 51st St., Kansas City, KS 66106
Phone: 913.342.0404
[synergetixnet.com]
Ultra Performance Pico Socket
Jan 2001
>1000
0.75
Spring probe
.25 at .75 mm pitch
500K
Auto and hand test, HAST, Prototype
Most packages, consult manuf.
All custom designed
Tim Dowdle, Marketing Manager
tim@synergetixnet.com
Northwest USA: Chris Huhn (San Jose, CA)
Phone: 408.272.9065 chrish@synergetixnet.com
East Coast: Alan Niesel (Westport, MA)
Phone: 508.636.2949alann@synergetixnet.com
Tecknit Interconnection Products (Part of TWP Corp.)
129 Dermody St., Cranford, NJ 07016
Phone: 908.272.5500
[fuzzbuttons.com]
Pivoting Arm Hand Clamp
1999
12x12x128
0.8 and 0.5
AuBeCu Fuzz Buttons with Crown Hard Hats
Not supplied 50K+
Hand test
Small BGA, LGA, PGA
N/A
Arthur Pittius,
Sales and Marketing Manager
Phone: 908.272.5500 x265
Micro Slide Cock, Hand Clamp
2000
9x9x81
0.8 and 0.5
AuBeCu Fuzz Buttons with Crown Hard Hats
Not supplied 50K+
Hand test
Small BGA, LGA, PGA
N/A
Texas Instruments Interconnection Business
111 Forbes Blvd., Mansfield, MA 02048
Phone: 508.236.5275
[ti.com]
CBG/FBGA Family
Jan 1999
Up to 384
Down to 0.5
BeCu Springs
6
10K
Burn-in, test
DRAM, Flash, SRAM, Stacked Die
N/A
Larry Furman, Sales and Mktg. Manager
lfurman@ti.com
Texas Instruments Deutschland GmbH, Haggertystrasse 1, D-85356 Freising, Germany
TI Japan Limited, Nishi-Shinjuku Mitsui Bldg.,
6-24-1 Nishi-Shinjuku, Shinjuku-ku,
Tokyo, Japan 160-8366
URex Precision Inc.
68-1, Kuangfu N. Rd.,
Hsinchu Industrial Park, Taiwan 303
Phone: +886.3.5972123
[urex.com.tw]
CSP-BGA Socket Family
Not supplied
36-56
0.75, 0.8, 1.0
Ring-pad-on-flex
14
20K
Burn-in
BGA, CSP
N/A
Hans Ho,
President and CEO
sales@urex.com.tw
WELLS-CTI (Merger of Wells
Electronics Inc. and CTI Technologies)
2102 W. Quail Ave., Ste. 2,
Phoenix, AZ 85027
Phone: 219.287.5941 [wellscti.com]
777 Series CSP
2000
6-256
0.8, 0.75
Four-point pinch contact
N/A
10K
Burn-in, programming, read/write, reliability
FBGA, µBGA, other CSPs
All automated loaders
John Hartstein,
Director of Business Development
Phone: 219.287.5941 x251
hartsteinj@wellscti.com
Yamaichi Electronics USA Inc.
(Subsidiary of Yamaichi Electronics Co. Ltd.)
3-28-7 Nakamagome, Ohta-Ku,
Tokyo 143, Japan
[yeu.com]
NP291 Series
1996
36-288
0.75, 0.8
Tweezer style
5-7 10K
Burn-in, test
FBGA, µBGA
Not supplied
BoPhone: Million, Marketing Manager
Phone: 408.456.0797 x129
bob.m@yeu.com

U.S.: 2235 Zanker Rd.,
San Jose, CA 95131
Germany: Karl-Schmid Strasse 9,
D-81829 Munich
NP352 Series
1999
48-1849
1.0
Tweezer style
5-7 10K
Burn-in, test
FBGA
Not supplied
IC299 Series
2001
8-304
1.27
Y-rocker style
1.11 100K
High-speed test contactor
Peripheral array, including MLP, QFP, SOP, TSOP
All handlers
 
Copyright © 2001