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MEPTEC/CPMT SiP Event Brings Packed House
Sunnyvale, Calif.-A February one-day symposium brought a standing- room-only crowd to a system-in-package symposium co-sponsored by MEPTEC and IEEE's CPMT.
Dr. Tom Di Stefano, moderator, observed after the program that there now seem to be more stacked packages than wafer-level packages.
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John Sovinsky, CAD Design Software, points to a graphic onscreen during his presentation.
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Dr. Richard Dasher (left), of Stanford's U.S.-Japan Technology Center and Dr. David Angst, consultant, were among the attendees.
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Soon Chi of Xilinx, left, chats with Seth Alavi of Sunsil Inc.
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Dr. John Carson of Irvine Sensors (left), who spoke on "System in a Cube," trades industry repartee with Dr. Tom Di Stefano.
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John Baliga, former Semiconductor International associate editor, who recently joined TruSi as marketing director, listens to a presentation.
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Lee Smith of Amkor, who presented a paper on "Advancements, Trends and Applications in
3D and Thin Packaging Technologies," is absorbed in the proceedings. Behind him and to the right are Bill Carlson, Tessera, and Bance Hom, consultant.
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