Media Kit
For advertisements and demographics
click here
 
 Current Advertisers

List of the sponsors

 Publisher's Letter
A Very Happy First Birthday to Us!
 
 Assembly Lines
Never Underestimate the Power of the Internet for Packaging Foundries
 
 Electronic Trends
Leadframe CSPs Provide an Expanding Solution to Cost Objections
 
 Standards
JEDEC's JC-11 Committee Standardizes Leadframe-Based CSPs
 
 Wafer - Level Watch

Flip-Chip and/or CSP: Separating the Sheep from the Goats

 
 On Test
Money for Test R&D Is Tiny Compared to IC Fabrication Dollars
 
 CSP Automation
Working with SECS to Automate CSP Processing
 
 Industry News
Trade Show Wars: NEPCON West Fizzles, APEX 2000 Sizzles
People in the News
Company News
Calendar of Events
 
 Features
Smooth Sailing Ahead for Test and Burn-in Sockets
Socket Manufacturers and Specifications
Meet the New Kid on the Flip-Chip Lithography Block
Assembly Considerations for micro SMD Wafer-Level CSPs
An Expert Looks at the Issues™
 
 Technical Forum
Advantages of Surface-Mount CSP Burn-in Sockets
Silicone Packaging Materials with Low Alpha Particle Emissions Prevent `Soft Errors'
 
 Tools & Technologies
ERSA Offers New Inspection System and more
 
 Contacts
Industry Contacts
 
 Patents
Stackable 3-D Chip-Scale Package Uses Silicon as the Substrate
 
 Archives
2000
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1999
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1998
  Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec

  Subscription
Free U.S. Subscription Form


 
 
An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics

July - August 2000

Email the editor

 Calendar of Events

Subject to space available, Chip Scale Review will list conferences of interest to the international chip-scale-electronics community without cost to the sponsoring organizations. Please fax your listing at least one month in advance of issue date to the Editor at 209.824.2799. You may also e-mail your listing to chipscale@cs.com.

MAY

3-4

NEPCON Philadelphia

King of Prussia, Pa.
Reed Expo [nepcon.com]
8-9 2000 European VLSI and
Microsystems Packaging
Workshop

Cork, Ireland
IEEE CPMT Society
[http://nmrc.ucc.ie]
9-10 SEMICON Test, Asembly &
Packaging 2000

Singapore
SEMI [semi.org]
21-24 Electronic Components and
Technology Conference

Caesar's Palace, Las Vegas, Nevada
IEEE [ieee.org]
JUNE

7-9

6th Annual National Conference
on Flexible Circuits

Doubletree Hotel, Dallas
IPC [ipc.org]
13-14 NEPCON East
Boston
Reed Expo [nepcon.com]
15 IMAPS-Israel 2000
Carlton Hotel, Tel Aviv
General Chair: Uri Barneah
ubarneah@inter.net.il
IMAPS [imaps.org]
18-20 IMAPS-Europe 2000
Prague, Czechoslovakia
Chair: Pavel Mach, CTU Prague micro@guarant.cz
IMAPS [imaps.org]

JULY

10-14

SEMICON West
10-12 Moscone Center, San Francisco
Wafer processing
12-14 San Jose Convention Center Packaging, Assembly and Test SEMI [semi.org]
30-4 International Symposium on Optical Science and Technology
(45th Annual Meeting of SPIE)
San Diego, Calif.
SPIE [spie.org]
AUGUST

1-4

Cleanrooms Asia/Datasor Asia

Raffles City Convention Centre Singapore
PennWell and Times Publishing Group
[pennwellnet.com]
 
 
  Copyright (C) 2000