Media Kit
For advertisements and demographics
click here
Current Advertisers
 Publisher's Letter
Get Ready for the Upturn!

 Assembly Lines
Are MEMS, MOEMS and Opto-Electronics in Your Future?

 Electronic Trends
Industry Outlook: IC Unit Shipments and Revenues Poised for Decline

 On Test
Are You Ready for the Personal Tester?

 Industry News
HD International Debuts at Silicon Valley Venue
Company News
People in the News
Packaging Foundries
Calendar of Events
Editorial Index

 Features
Cover Story: IC Packaging Foundries - A Work In Progress
Packaging Foundry Vendor Table

Special Report: The Status of the Worldwide Packaging Foundry Industry 2001

Opinion: CSPs Are Putting a New Spin on IC Assembly

An Expert Looks at the Issues: Ed Combs on Integrated Circuit Assembly

 Tutorial
An Overview of Flip-Chip Technology

 Feature/Materials
Using Silicone Materials in Lead-Free CSP Processing

 Technical Forum
The Effects of Pb Contamination on the Material Properties of Sn/Ag/Cu/Bi Solder

 Tools & Technologies
300-mm-Capable Die Attach System Debuts and more...

 Patents
Composite Ceramic Substrate Minimizes Microcracking

 Archives
2001
Jan-Feb March April
May-June July  
2000
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1999
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1998
  Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec


Subscription

 
Current Issue
An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics
May - June 2001

Calendar of Events

Subject to space available, Chip Scale Review will list conferences of interest to the international chip-scale-electronics community without cost to the sponsor. We regret, however, that we are unable to list events sponsored by commercial organizations. Please fax or e-mail your listing at least two months prior to cover date to the editor at 209.824.2799 or chipscale@cs.com.

May

29-June 1

The 51st Electronic Components and Technology Conference (ECTC)
Wyndham Palace Resort and Spa, Lake Buena Vista (Orlando), Fla.
This year's ECTC will feature more than 250 technical papers in 38 sessions, covering the latest innovations in electronics. Areas covered will include advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processing, quality and reliability, manufacturing technology, components and RF, connectors and contacts.
IEEE [ieee.org], CPMT, EIA/ECA
June

11-13

Seventh Annual National Conference on Flexible Circuits
11 Workshops,12-13 Conference & Exhibits
Marriott Hotel, Fremont, Calif.
IPC [ipc.org]

18-19

Flip Chip 2001 Conference & Exhibition
Four Seasons Hotel, Austin, Texas
With the predicted growth of the flip-chip industry, IMAPS decided that a larger venue was needed for this year's program, resulting in a move from the former venue in Braselton, Ga.The technical program will continue to focus on recent advances in flip-chip technology and ways to implement them.
A focused exhibition will feature suppliers who support the industry.
IMAPS [imaps.org],
Peter Elenius, General Chair [pelenius@flipchip.com]

July

16-20

SEMICON West
16-18 San Francisco, Moscone Center,
18-20 San Jose Convention Center
Downturn or no, expect a fully packed SEMICON West in both venues as exhibitors prepare to show their best face to the buying world. Visitors for the exhibits only will save $50 by registering online by July 9. If you register by June 15, you will receive your badge in the mail. If you register by July 9, your badge will be available onsite.
SEMI [semi.org]
[customerservice@semi.org]

 
Copyright © 2001