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HD International Debuts at Silicon Valley Venue
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Santa Clara, Calif.-The Inter-national Conference and Exhibition on High Density Interconnect and Systems Packaging made its northern California debut April 17-20 at the Santa Clara Convention Center.
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Show visitor Chris Daly (left) learns about new technology from James Miinadeo of AI Technology, Princeton Junction, N.J.
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From left, Phil Davies of Allteq Industries, Fremont, Calif., talks business with Dodge Jaillet and Jesse DeGennaro of Dymatix, Santa Clara.
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Scott Allen and Heather Simington of Johnstech International, Minneapolis, were among several socket vendors at the expo.
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From left, Frank Scanlon of OSE Inc., San Jose, and consultant Al Conte discuss Toray's newest products with Tatsuo Nagamatsu, Shiga, Japan.
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Dr. Bruce Gehman and Bettina Weiss of SEMI, San Jose, visit with Dow Corning's Doug Houtman, Midland, Mich.
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Bruce Blaisdell (left) and Paul Wakefield, National Semiconductor, observe the show from their booth.
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