ASAT Appoints Bob Bajoni VP Sales-Europe Fremont, Calif.-ASAT has named Bob Bajoni vice president of sales and customer support for ASAT Europe. He will be responsible for European sales for ASAT plants in China, Hong Kong and Nancy, France. Bajoni is based in Switzerland and opened ASAT's first European sales office in 1989. He was earlier with EM Micro-electronics/Swatch Group as vice president of sales. [asat.com]
ASE Adds TCPs and Lead Bumping Services Khaosiung, Taiwan-Advanced Semiconductor Engineering (ASE) has added tape carrier packages and high lead bumping to its product portfolio. ASE says that tape carrier packaging is moving into the mainstream for LCD driver chips. Based on LCD industry figures, last year, Taiwan's LCD market increased by 130% to NT$1.3 billion, according to the company. ASE says that estimates indicate that by 2003 at least half of all computers will be notebooks, which will employ LCDs. According to J.J. Lee, ASE's vice president-R&D, "We estimate that our TCP production capacity" may be as large as a million units/month in Q1 2001. ASE says it can position up to 480 inter-connects on the smallest 50-micron LCD driver chips. ASE says it expects production capacity for bumped chips to reach about one million/month during Q1. ASE says high lead bumping provides a solution to the problem of instability with decreasing bump size. [aseglobal.com] ASE and Conexant Will Cross-License Technologies ASE also recently announced a cross-licensing agreement with Conexant Systems Inc.[conexant.com], Newport Beach, Calif. Both companies will exchange advanced IC assembly technologies. ASE will acquire Conexant's RF land grid array design and process and Conexant will receive ASE's fine pitch BGA technology.
Carsem Adds Catalyst to ATE Platforms Ipoh, Malaysia-Carsem has added several Teradyne Catalyst-100 ATE systems to its production test equipment. The Catalyst testers are designed for newer generation SOCs and System-in-Package devices for the telecom and wireless markets. Carsem's equipment portfolio includes more than 150 testers. [carsem.com] CS2's Q4, Year Results: Revenue Up, Income Down Brussels-CS2, now operating under creditor protection from the Brussels Court of Commerce until June 20, has reported a loss of EUR $9.885 million (1 EUR=$0.89 USD) on revenues of EUR 8.34 million for Q4 2000. For the year, CS2 reported a loss of EUR $24.814 on revenue of EUR $25.790 million. The company said "all production lines show continued improvements both on yields and cycle-time during Q4." CS2 also said it expects to become cash-flow positive during Q4 of this year. "The weakness of the U.S. dollar, the slow market and the stock adjustments of some of our customers are delaying our (cash-flow) target," the company announced. In a statement released by the company, management said, "Notwithstanding the liquidity problems and the creditor protection that was granted, the fundamentals of our company are healthy." [cs2.be] Siliconware Offers Flip-Chip Process Taichung, Taiwan-Siliconware Precision Industries Ltd. (SPIL) has successfully transferred wafer bumping and redistribution technologies from Flip Chip Technologies, Phoenix, Ariz., a joint venture of Kulicke & Soffa and Delphi Delco Electronics Systems. SPIL will employ FCT's proprietary Flex-on-Cap to make flip-chip packages at SPIL's new wafer bumping facility in Taichung. [spilca.com]
NEC Tags STATS for Turnkey Services Singapore-ST Assembly Test Services (STATS) says NEC Corp. of Japan, has selected the IC assembler for a three-year manufacturing agreement to provide turnkey test and assembly service for ICs employed in hard disk drives. STATS expects the agreement to generate about US $20 million over the three years. [statsus.com] Oops, We Moved Carsem! In our March article on dispensing, we incorrectly placed Carsem in Kuala Lumpur, Malaysia. The company is located in Ipoh, about 2-1/2 hours north of K.L. and 1-1/2 hours south of Penang by ground transportation. [carsem.com]
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