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Cover Story: IC Packaging Foundries - A Work In Progress
Packaging Foundry Vendor Table

Special Report: The Status of the Worldwide Packaging Foundry Industry 2001

Opinion: CSPs Are Putting a New Spin on IC Assembly

An Expert Looks at the Issues: Ed Combs on Integrated Circuit Assembly

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Using Silicone Materials in Lead-Free CSP Processing

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The Effects of Pb Contamination on the Material Properties of Sn/Ag/Cu/Bi Solder

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300-mm-Capable Die Attach System Debuts and more...

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Current Issue
An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics
May - June 2001
Tools & Technologies
The Alphasem Swissline 9022 accepts wafers up to 300 mm.

300-mm-Capable Die Attach System Debuts

Alphasem of Berg, Switzerland, has announced the fully automatic, 300-mm-capable Swissline 9022 die attach system.

The first unit, according to the Universal Instruments' subsidiary, has already been delivered to "one of the world's largest semiconductor manufacturers."

The vendor claims changeover to different wafer sizes can be accomplished in as little as five minutes. The system also processes two wafers in parallel, resulting in a productivity increase.

The Swissline 9022 was introduced at SEMICON Singapore. [alphasem.com]

IDI's FixtureForum.Com Opens on the Web

Interconnect Devices Inc. of Kansas City, Kansas, has introduced a new Website for fixture specifiers: fixtureforum.com.

IDI terms the site, "the first online marketplace for quotes, information and more" about fixtures.

The site, according to IDI, "provides a neutral marketplace that opens each potential user to the broadest range of fixture vendors they can find in one place."

Among its features, fixtureforum.com describes fixture houses and their specialties, posts technical info from fixture houses, finds resources for unusual fixturing requirements and posts ratings of fixture suppliers from site users. [idinet.com]

The Alpha employs a 60W spot system consisting of two dichroic lamps.

Low-Cost Stereo Microscope Offers 160x

Vision Engineering of Surrey, England, has developed a unique, low-cost, stand-alone stereo microscope, the ISIS Alpha, with a zoom range of 6x-40x. Optional boosters enable a maximum 160x magnification.

The company claims that the unit features improved ergonomics and exceptional light efficiency, and is meant to compete with conventional microscopes.

An enhanced illuminator configuration deploys a 60W spot system comprising two low-cost dichroic lamps with an extended life of 600-800 hours. The unit can be fitted to either a bench stand or a boom mount.

Ergonomic advantages include the company's "Expanded Pupil" eyepiece technology, which allows a 4x increase in working distance between the operator's eyes and the unit, permitting greater freedom of operator head movement. The increased working distance also allows users with corrected vision to continue wearing prescription spectacles. [visioneng.com]

High-Performance MLP Sockets Offered

Gryphics Inc. of Minneapolis, Minn., has released a family of low-cost, high-performance Micro Leadless Package sockets for development, production test and burn-in.

The socket family consists of standard off-the-shelf format assemblies and replacement contact sets with delivery from stock for all JEDEC MO-220-compliant devices. The sockets feature <1 nH inductance, <0.1pF capacitance and low loss of 1 db at 5-6 GHz.

The sockets are maintained by replacing the standard contact set and reusing the base socket. The standardized footprint and components allow PWB geometry to be downloaded electronically for importing into design software.

Custom configurations are also available through the company or an authorized integrator or OEM. [gryphics.com]

The K&S Triton RDA (Ribbon Deep Access) Bonder

Kingpak Adds QS-9000 Credentials

Kingpak Technology was recently certified to QS-9000 by SGS Yardsley Certification Services. QS-9000 defines quality systems requirements for the automotive industry. [kingpak.com]

Ribbon Bonder Promises Fastest Wire Cycles

Kulicke & Soffa, Willow Grove, Pa., has introduced the Triton RDA (Ribbon Deep Access) Bonder, the first member of a new family of automatic wedge bonders designed for ribbon bonding.

The Triton RDA combines the industry's fastest cycle speeds (claimed to be 2x that of the nearest competitor for 1-mil high x 10-mil thick wires) with deep access capabilities and a fully automatic material handling system.

K&S has designed the unit for devices employed in the fast- growing wireless, tele-communications, opto and power electronics markets.

The Triton RDA offers 1-inch of bondhead Z stroke and deep access, 90 degree wire-feed angle that enables bonding packages with deep cavities and large downsets. The company claims that the combination of wedge bonding technology, exceptional looping control and ribbon wire can provide performance and reliability advantages. [kns.com]

March Instruments' MultiTRAK in-line plasma cleaning system

Plasma Cleaning System Features Strip Handling

March Plasma Systems, Concord, Calif., a subsidiary of Nordson Corp., has introduced the MultiTRAK multi-strip, in-line plasma cleaning system.

The system enables IC package assemblers to integrate a high throughput, in-line plasma treatment system into area array and flip-chip production lines to improve yields during the assembly process.

Featuring an innovative handling system, the MultiTRAK system can process from two to seven strips in less than one minute. The handling system's flexible architecture allows for reconfiguration in the field, including changing the number of substrates being processed per run, as well as the dimensions of the substrates.

The unit offers single-lane in/out feeds, allowing it to be integrated with loaders. It can also be operated in an island form factor to feed a designated line of equipment, including die attach systems, wire bonders or encapsulation equipment. [marchplasma.com]

 
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