Dr. Tom DiStefano on Wafer-Level CSPs

Dr. Tom Di Stefano is an internationally recognized pioneer in the fields of chip-scale and wafer-level packaging. He is a founder of Tessera, San Jose, the inventor of the widely adopted µBGA CSP. He is also the founder of Chip Scale Review and of the Chip Scale International Show (recently acquired by SEMI). An active inventor, Tom has authored or co-authored more than 46 patents in packaging, semiconductors and storage. Before founding Tessera, Tom spent 19 years with IBM at the T.J. Watson Research Center. He earned a Ph.D. in applied physics from Stanford University and a BSEE with highest honors from Lehigh University. Contact Tom at tomd55@aol.com or phone 408.395.0118.