May - June 1999
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Taiwan's Kingpak Technology Offers TinyBGA Package
Hsinchu, Taiwan—Kingpak Technology, an IC packaging foundry, is offering its proprietary TinyBGA™ chip-scale package for a wide range of applications.Kingpak says the TinyBGA is 70 percent smaller than an equivalent pincount TSOP or QFP, but offers high reliability and lower cost than other CSPs.
The company says it has shipped millions of TinyBGA packages for PC memory module applications to date.
"With the TinyBGA family, our customers can quickly and easily add CSP options to their product offerings or plan new products using CSP outlines," according to Larry Sannes, sales and marketing director at Kingpak's U.S. headquarters in Santa Clara, Calif.
The interconnection to the TinyBGA is accomplished with wirebonding to a rigid or flex BGA substrate. That allows standard package outlines to be adapted to existing chip designs. Chip revisions, such as die shrinks can be implemented without changing the package outline, Sannes says.
A "nearly infinite range" of package options are available, from 5 x 5 mm to 17 x 17 mm and up to 256 leads. www.kingpak.com