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Bumping Service Provider Directory
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Wafer Bumping Service Providers |
Employees
A = <100
B = 100-500
C = 501-1,000
D = 1,001-2,000
E = 2,001-5,000
F = >5,000
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Customers by Region
AS=Asia (except Japan)
EU=Europe
JP=Japan
NA=North America
RW=Rest of World
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Quality Audits
A=ISO-9001
B=ISO-9002
C=ISO-14000
D=SAC Level 1
E=QS9000
F=Other
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Technology
EL=Electroless
EP=Electroplating
EV=Evaporation
SC=Screening
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Percentage of Alloys
63=63/37
HL=High Lead
LA=Low Alpha
NL=No Lead
O=Other
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Company
Address
Phone
Fax
Year Founded
Advertisers in Bold Face |
Employees |
Maximum Number of Bumps |
Customers by Region
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Quality Audits |
Bump Pitch
(microns) |
Technology
|
Percentage of Alloys
HL=high lead
NL=no lead
63-37=63/37
LA=low alpha
O=other |
Wafers per Month
Capacity
|
Maximum Size (mm) |
Steppers or Aligners |
Manufacturing Area in Square Meters |
Web site
Contacts
Additional Offices
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Advanced Interconnect
Solutions
536 Weddell Dr., Suite 1
Sunnyvale, CA 94089
Phone: 408.745.1791
Fax: 240.282.4862
Founded: 1998
(Pres)(CEO) Victor Batinovich |
A |
>2000 |
Not Supplied
|
Not Supplied |
200 |
EP, EL, SC |
N/A |
12K |
200 |
Not Supplied |
Not Supplied |
aissales@icassembly.
Danny R. Fields, Sales Director dfields@icassembly.com |
Amkor Technology Inc.
1345 Enterprise Dr.
West Chester, PA 19380
Phone: 610.431.9600
Fax: 610.431.5881
Founded: 1970
(C/CEO) James J. Kim
(CEO/COO) John N. Boruch
|
F |
>3500 (1728 HPGA ) |
AS=15, EU=17, JP=15 |
A,B,C,D,E,F |
200, 225, 250 |
EP, SC |
HL=5
63-37=95
|
12K |
200
(300 mm in 2003) |
Aligners |
Not Supplied |
amkor.com
C.J. Berry, Product Mgr Flip-Chip Development cberr@amkor.com
Patrick McKinney, Senior VP Corp. Marketing pmcki@amkor.com
Operations HQ: 1900 South Price Rd., Chandler, AZ 85248
Phone: 480.821.5000 Fax: 480.821.8276
3945 Freedom Circle, Ste. 830, Santa Clara, CA 95054
Phone: 408.496.0303 Fax: 408.496.0392
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APack Technologies Inc.
Hsinchu, Taiwan
Phone: +886.3-578.8766
Fax: +886.3.563.2911
Founded: 1996
(C/CEO) Richard Chuang
|
B |
1,079
FCBGA |
AS-25
EU-5
JA-10
NA-60
|
B |
200,
225 |
SC |
N/A |
8K (15K August 2001) |
200 |
Steppers |
Not Supplied |
apack.com.tw
Masayuki Ohi, Assistant VP, Marketing & Sales
masaohi@apack.com.tw
U.S. Representative:
AIS
Danny R. Fields, Sales Director
dfields@icassembly.com
Phone: 408.745.1791
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Aptos Corp.
1157 Centre Pointe Dr.
Milpitas, CA 95035
Phone: 408.956.7988
Fax 408.956.7979
Founded: 1986
(C) John Hsuan
(P) C.S. Ho
(CEO) Same |
A |
N/A |
Ax-10
Eu-15
Na-75 |
B |
60 (gold), 200,250 (solder) |
EV, EP, EL |
63=30, HL=20, 0=50 |
10K |
200 |
Aligners |
Not Supplied |
aptoscorp.com
John Lee, Sales & Marketing Executive
jlee@aptoscorp.com
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ASE Inc.
333 Keelung Rd., Sec. 1, Taipei, Taiwan
Phone: +886.2878.0548
Fax: +886.2757.6121
Founded: 1984
(C) Jason Chang
(P) Dr. Leonard Liu
(CEO) Richard Chang
|
F |
3600 |
AS=30, EU=3.7, JP=1.1 |
B, C, D, E |
150, 200, 225 |
SC=100 |
HL-5
63=94,
LA=1 |
15K |
200 |
Aligners |
Not Supplied |
aseglobal.com
ASE (U.S.) Inc., 3590 Peterson Way,
Santa Clara, CA 95054
Phone: 408.986.6500
Fax: 408.565.0289
Jennifer Yuen, Marketing Director
jennifer.yuen@aseus.com
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Carsem
Jalan Lapangan, Terbang, 30720 Ipoh, Perak, Malaysia
Phone: +60.5.312.3333
Fax: +60.5.312.5333
Founded: 1972
(C) Kwek Leng San
(COO) David Comley, Group Managing Director
- Currently uses outside services, but plans internal capability by the end of this year. |
F |
43
CBGA-FC |
AS=5, EU=30, JP=5, NA=60 |
A, B, C, D, E |
225 |
EP=N/A SC=N/A |
HL=50
63=50 |
N/A |
200 |
Neither
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Not Supplied |
carsem.com
Carsem Inc. (USA), 17890 Castleton St., Ste. 245
City of Industry, CA 91748
Phone: 626.854.0939
Fax: 626.854.9139
Gerry Blackholly, VP-Sales & Marketing gblackholly@carsem.com
Carsem Inc. (USA), 269 Mt. Hermon Rd., Ste. 104
Scotts Valley, CA 95066
Phone: 831.438.6861
Fax: 831.438.6863
Paul Smith, Marketing Director psmith@carsem.com
Carsem Europe, 1st Floor, Potters Walk, 134 High St.
Swindon, SN4 7AY England Phone: +44.1793.853888
Fax: +44.1793.855388 |
Chipbond Technology Corp.
Hsinchu, Taiwan
Phone: +886.3.567.8788
Fax +886.563.8958
Founded: 1977
(C/CEO) Chunghsin Lee
(P) F.J. Wu |
C |
1000
FCBGA |
AS=30
EU=20
JA=30
NA=20 |
B, E |
32 (gold), 200 (solder) |
EP=100 |
HL=30
63=70 |
80K |
200 |
Aligners |
7,000 (Hsinchu) |
chipbond.com.tw
Chunnghsin Lee
clee@chipbond.com
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Fujitsu Tohoku Electronics Ltd.
4, Kogyodanchi, Monden-machi
Aizuwakamastu-shi, Fujushima 965-8577, Japan
Founded: 1981
(CEO/P) Shunji Kumakura |
F |
11,000 |
AS=10, EU=40
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A, B, C |
150,
225,
250 |
EP
SC
(Under dev.) |
HL=60
63=40 |
20K |
200 (300 in 2002) |
Both |
Not Supplied |
fujitsumicro.com
Fujitsu Microelectronics Inc.
3545 N. First St., San Jose, CA 95134
Phone: 800.866.8608
Fax: 408.954.9462
Dennis Stephenson, Director of Advanced Packaging Services
dstephen@fmi.fujitsu.com
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IC Interconnect
1025 Elkton Dr., Colorado Springs, CO 80907
Phone: 719.533.1030
Fax: 719.533.1021
Founded: 1998
(C) Larry Heitz
(VP/GM) Curt Erickson |
A |
No Limit |
Not Supplied |
A, E |
15 (UBM), 200 (solder) |
EL, SC |
HL=2,
63=96 |
25K |
200 |
NA |
Not Supplied |
interconnect.com
Jay Hayes, Sales & Marketing Manager
jhayes@interconnect.com
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Kulicke & Soffa
Flip Chip Division
(Formerly Flip Chip Technologies)
Phone: 602.431.6020
Fax: 602.431.6021
Founded: 1996
(C) C. Scott Kulicke
(P/CEO) Gil Olachea |
Not Supplied |
3500 |
AS=1
EU=6
NA=93
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B, E |
160
200
225 |
Proprietary |
63=75, HL=1 |
25K |
200 |
Both |
4,500+ (Phoenix) |
flipchip.com or kns.com
Jim Wood, Director-Flip Chip Products
jwood@kns.com
Jim Graham, U.S. Sales Manager
1.800.523.1321 ext. 5362
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Megic Corp.
Hsinchu, Taiwan
Phone: +886.3.578.8076
Fax: +886.3.563.0136
Founded: 1999
(C/CEO) Dr. M.S. Lin
(P) Ling Chen
|
B |
3000 |
AS=85
JA=5
RW=10 |
N/A |
45 (gold)
200 |
EP=100 |
HL=80
63=20 |
20K (gold)
10K (solder) |
200 |
Steppers |
1,600 (Hsinchu) |
megic.com.tw
Vang Cheong
vangc@megic.com.tw
(Shinko licensee)
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Pac Tech GmbH
Am Schlangenhorst 15-17
14641 Nauen, Germany
Phone: +49.3321.4495.0
Fax: +49.3321.4495.23
Founded: 1995
(C/CEO/P) Dr. Elke Zakel
info@pactech.de
Thomas Oppert, VP-Marketing & Sales oppert@pactech.de
|
A |
1000 (LCD driver) |
AS=10
EU=50
JA=10
NA=30 |
A |
70 |
EL=70
SC=30 |
NL=10
63=90 |
15K (each Germany & Japan) |
300 |
Both |
500 (each, Germany and Japan) |
pactech.de
Pac Tech USA
750 Menlo Ave., Menlo Park, CA 94025
408.888.0352
Ronald G. Blankenhorn, President
blankenhorn@pactech.de
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SPIL Group
(Siliconware Precision Industries Ltd.)
Nr. 123, Section 3, Da Fong Rd., Taichung, Taiwan
Founded: 1984
Phone: +886.4.534.1525
Fax: +886.4.533.0639
(C/CEO) Bough Lin
(P) C.W. Tsai
|
F |
14,000 |
AS=42
EU=5
JA=8
NA=45 |
A, B, C, E |
200 |
SC=100 |
63=90, LA=10 |
10K |
200
(300 in 2002) |
Both |
Not Supplied |
spil.com.tw
Siliconware USA Inc.
1735 Technology Dr., Ste. 300, San Jose, CA 95110
Phone: 408.573.5500 Fax: 408.573.5530
Eleanor Feng, Director of Marketing & Business Development
eleanor@spilca.com |
ST Assembly Test Services Ltd. (STATS)
5 Yishun St. 23, Singapore 768442
Founded: 1995
Phone: +65.755.5885
Fax: +65.755.5431
(C/CEO) Tan Bock
|
E |
Not Supplied |
AS=9.7, EU=18.4, NA=71.9
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A, B, C, D, E |
200, 225, 250 |
EP
SC |
63=100 |
Not Supplied |
200 |
Aligners |
Not Supplied |
stts.com
Note: customers in percent by region, Japan is not broken out from the rest of Asia.
ST Assembly Test Services Inc.
1450 McCandless Dr. Milpitas, CA 95035
Phone: 408.941.1500
Fax: 408.941.1501
George Brathwaite, Sales Dir.
gab@statsus.com
ST Assembly Test Services Inc.
9180 S. Kyrene #101 Tempe, AZ 85284
Phone: 480.961.7033
Fax: 480.961.9511
Jeff Osmun, VP-N. Am. Sales
osmunj@statsus.com
ST Assembly Test Services Inc.
144 Turnpike Rd., Ste. 320
Southboro, MA 01772
Phone: 508.624.6800
Fax: 508.624.6850
Chris Langhammer, Sales Dir.
langhammer@statsus.com |
STECO
Chungcheongnam-Do, Korea
Phone: +82.41.861.1855
Fax: +82.861.1892 Founded: 1995
(CH/P) Jung Ehung Kim |
B |
Not Supplied |
Not Supplied |
A,C
|
Not Supplied |
Not Supplied |
Not Supplied |
Not Supplied |
Not Supplied |
Not Supplied
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Not Supplied |
steco.co.kr
Seh-Hyuk Oh
oshcap@steco.co.kr
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Unitive Advanced Semiconductor Packaging
4512 S. Miami Blvd.
Research Triangle Park, NC 27709
Phone: 888.bumping
Fax: 919.941.5097
Founded: 1996
(CH) Mark Hilson
(P) Wayne Machon |
B |
No limit |
AS=11, EU=6, JA=1, NA=82 |
A
|
50, 150, 200, 225 |
EP=70
Ball Loading=30 |
HL=30
63=70 |
24K (solder), 10K (gold) |
200 (300 in 2003) |
Aligners |
3,500 |
unitive.com
Robert Lanzone, VP-Sales & Marketing
rlanzone@unitive.com
*note: All EP alloys are LA
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