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On Line Reader Service
 Publisher's Letter
SEMICON West: What a Difference a Year Makes!

 Assembly Lines
STS Defies Conventional Onshore Model for IC Package Assembly Plant

 Electronic Trends
RF Packaging Poses New Challenges

 Standards
Standardization of Quad and Dual-Inline Leadframe-Based CSPs Is Accelerating

 Wafer-Level Watch
Stanford Seminar Program Gauges the Impact of WLP

 On Test
Strip Handling Promises Better Throughput

 Industry News
Company News
People in the News
Research & Development Spotlight
Letter to the Editor
Inspection, Test & Measurement
Packaging Foundries
Calendar of Events
Editorial Index

 Features
Special Report: Flip-Chip Packaging - A 32-Year-Old Infant Grows Up
Bumping Services Provider Directory

Cover Story: Steppers vs. Aligners - Two Technologies Race for the Finish Line in Wafer-Level Packaging

Stacked Chip-Scale Packages: They're Not Just for Cell Phones Anymore!

Known-Good Die for Stacked CSPs: It's Not Your Father's KGD Anymore!

Packaging Trends in Cellular Phone Applications

An Expert Looks at the Issues: Dr. Tadatomo Suga on Interconnection Technology

 Tutorial
Wafer Bumping: A Guide to Selecting the 'Correct' Process

 Technical Forum
A Semi-Additive Electroless Ni/Au Process Offers a Low-Cost Wafer-Bumping Method

The Effects of Pb Contamination on Lead-Free Sn/Ag/Cu/In Solder

 Tools & Technologies
ESEC's 3088iP Wire Bonder and more...

 Opinion
Wafer-Level Packaging Is the Next IC Revolution

 Patents
CSP Manufacturing Process Lowers Production Cost and Improves Yield

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Current Issue
An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics
July 2001
Inspection, Test & Measurement
Toshio Maruyama

Advantest Promotes Company Veteran Maruyama to President

Tokyo-Toshio Maruyama has been promoted to Advantest president from senior managing director, replacing Hiroshi Oura, who becomes chairman and representative director.

Advantest's three earlier presidents were chosen from Fujitsu, which acquired Advantest in 1976.

In 1982, Maruyama was assigned to the U.S. to help establish Advantest's North American business. From 1990-1993, he served as president of Advantest America R&D Inc.

Maruyama's background includes hardware design, software development and sales and marketing of semiconductor test systems. [advantest.com]

Advantest's new M4541A offers simultaneous testing of up to four devices.

Advantest Intros New ASIC, SOC Test Handler

Tokyo-Advantest has introduced a new test handler targeted at devices such as ASICs, MCUs and SOCs. The handler will support a variety of socket arrays.

A new device handling mechanism and what the company terms "ultra-efficient" motion control provide simultaneous testing of up to four devices and a maximum throughput of 6,000 uph. [advantest.com]

Teradyne Ships 750th J750 to Philips Semi

Munich-Teradyne has shipped its 750th Integra J750 test system to Philips Semiconductors in Hamburg, Germany.

Philips will employ the 1024/512 pin system for testing microcontrollers for smartcard applications. [teradyne.com]

Schaffner's Handheld Tester Offers Comprehensive ESD Measurement

Edison, N.J.-Schaffner EMC Inc. has introduced an ESD tester claimed to offer all the features of a comprehensive ESD test system in a lightweight, handheld design for $7,650.

The NSG 435 features user-programmable discharge voltage from 200V to 16.5kV, built-in IEC 1000-4.2 test settings and battery operation. The unit can be used for stand-alone operation or integrated with a computer. [schaffner.com]

NSG 435 ESD tester The homepage of Aries' website.

Aries Expands Data on RF Test Socket Website

Frenchtown, N.J.-Aries Electronics has announced a major expansion of the RF test socket segment of its website.

The expanded website now features a full listing of design footprints for both manual and automatic applications, which engineers can view to see if the footprints match their needs. [arieselec.com]

 
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