ESEC's 3088iP Wire Bonder
Deliveries begin this quarter for ESEC's new 3088iP wire bonder, which offers ultrafine- pitch capability of 50 µm in production use. The bonder includes a new vision system with Cognex' PatMax technology. ESEC says PatMax enables faster die pad recognition, which improves equipment productivity. ESEC says it has optimized the z-axis, making the unit the "ideal platform" for both low-end (DIP, PLCC, QFP, SOIC) and high-end (BGA, QFN) packages. Offline programming allows users to teach recipes without tying up a production site. These recipes can then be easily transferred via host computer without interrupting production. In addition, new software tools, such as the parameter checker, improve long-term process reliability, since the bond force and ultrasonic power applied during bonding are checked and controlled according to their pre-defined values. [esec.com] Options Added to ECM-2040 Pick-and-Place System A color vision system option permits automatic placement of BGAs and QFPs to 57 mm2 with pitches down to 15 mil on Manncorp's ECM-2040 pick-and-place system. The system is claimed to provide excellent contrast for lead and ball inspection. Options now enable the ECM-2040 to be upgraded from 48 tape feeders to 72 or 96 tape capacity feeders through the use of automatic sliding feeder bases. Bolt-on and snap-on stick feeders and snap-on waffle tray holders are also available. A second head, enabling increased placement from 4,000 pph to 5,700 pph is also now available. [manncorp.com] Palomar Launches Laser Diode Attach System Palomar Technologies, Vista, Calif., has introduced a Laser Diode Attach system for packaging InP laser diode assemblies. The LDA first packages the diode assemblies onto carriers and then inside the selected package. Palomar says the LDA machine is built upon a large, open architecture optical breadboard with the flexibility to accommodate many optoelectronic assembly operations, including photodetector assemblies. [palomartechnologies.com]
K&S Introduces 'Maxµm' Automatic Ball Bonder Kulicke & Soffa, Willow Grove, Pa., has introduced the Maxµm automatic ball bonder, which offers 65 msec standard wire cycle speed, a number that equates to more than 15 wires/second. The result, claims K&S, is a 20% improvement in productivity over the company's own 8028-PPS, the fastest ball bonder currently on the market. The Maxµm also supports 45 micron production level process capability. [kns.com]
Seamless 300 mm Wafer Carriers Minimize Handling Engineering Plastics Inc., Westboro, Mass., has introduced seamless, one-piece 300 mm wafer carriers that feature a detachable handle and can fit inside dry transport systems to minimize handling. The EPI wafer carriers are molded and machined from PTFE or PTFM resins into carriers that are unaffected by photoresists, acids and corrosives. Featuring a detachable handle, the carriers have no pins, screws or dovetails to loosen or trap contaminants. [engineeringplastics.com] Submicron Flip-Chip Die Bonder Uses Optical Bondhead RD Automation, Piscataway, N.J., has introduced the CSB50-ST, a combination machine capable of bonding flip-chips, as well as die facing up in the same pass. The unit is capable of submicron placement accuracies, depending on the application. The company says the machine utilizes a unique optical bondhead in conjunction with a proprietary bonding scheme. [rdautomation.com]
SOI Cleaner-Bonder Combination Karl Suss, Munich, Germany, has entered the silicon-on-insulator market with the CL200 Cleaner/SOI Bonder, said to be the first system available that cleans, dries, aligns and bonds SOI substrates in one closed chamber. The CL200 pro-cesses two wafers simultaneously, and without separation between process steps, using silicon fusion bonding. [suss.de] Image Capture for Bond Testers Dage Precision Industries, Fremont, Calif., has added image capture as an option for its Series 4000 multipurpose bond tester. In addition to its availability on new systems, the hardware can be retrofitted to any existing standard Series 4000 tester. The image capture feature is for applications in R&D as well as in production, according to the company. [dage-group.com] New Materials Take Center Stage
Dexter, Multicore Announce Solder Paste, Encapsulants Dexter Electronic Materials [dexelec.com], a division of Loctite Corp., Industry, Calif., has introduced a family of new dam-and-fill encapsulant products designed to withstand 260\°C peak solder reflow temperatures without degradation. HYSOL FP4453 is a black, high-viscosity liquid that provides minimum flow, enabling the epoxy to act as a dam or flow control barrier around areas of bare chip encapsulation. HYSOL FP4450NL is a low-viscosity, high-flow, self-leveling fill that flows quickly, effectively penetrating and covering fine-pitch wires. Multicore Solders [multicore.com], Richardson, Texas, also a division of Loctite Corp., has announced CR36, a no-clean solder paste suitable for fine- pitch, high-speed stencil printing up to 200 mm/sec (without producing solder balls after reflow). Dow Corning, Samsung Develop, Improve Dielectrics Midland, Mich.-Dow Corning Corp. and Samsung Electronics Co., Seoul, Korea, have announced a joint development agreement to develop and refine interlayer dielectric applications using Dow Corning's XLK spin-on dielectric. Before introducing XLK last summer, Dow Corning worked with several key customers for more than two years on the compound's initial development. [dowcorning.com]
Alphasem EasyLine 8002 Is for Metallic Leadframe Alphasem, Berg, Switzerland, has announced the EasyLine 8002 die attach system. The unit is aimed at metallic leadframe applications, such as MLP, QFN, SOIC and TSOP formats. Depending on package type, the unit can deliver a throughput of up to 7000 UPH and a die placement accuracy of ±50 microns. With a footprint of 1 meter2, the system offers a pick-and-bond cycle which is independently programmable and closed-loop controlled. An optional snap cure oven has been specially designed for MLP and QFN applications, based on snap cure epoxies. [alphasem.com] BGA X-Ray Inspection System Connect2it, Incline Village, Nev., a supplier of interconnection products and vision systems, has introduced an x-ray inspection system aimed at BGA examination. The system weighs less than 100 pounds and can inspect BGA-packages for opens, voids, insufficient solder or misplaced balls on grid arrays. [connect2it.com]
AI Technology Develops Improved 'Tacky' Tapes AI Technology, Princeton, N.J., has developed improved "tacky" tapes for wafer dicing and grinding. These HTCR series tapes feature a consistent peel strength of ±25% gm/inch per roll, with tapes available in various peel strengths. Another improvement is "controlled release," which means the tape bond strength does not increase over time, providing a contaminate-free die after tape release. The tapes are made of a high temperature, water resistant, stretchable silicone-free material offering advantages over traditional PVC dicing and grinding tapes, according to the company. A UV releasing tape, offering the same benefits as the HTCR series, reduces the tack strength to 20 gm/inch, allowing the die to release cleanly. [aitechnology.com] Enhanced BGA Rework System Announced Metcal, Menlo Park, Calif., a unit of OK International, has launched an enhanced version of its BGA rework system, which is currently available in two models. Enhancements include an imaging camera that has been added to the existing vision system for applications with fine-pitch CSPs. Simplified system controls, accessible from the front of the machine, have also been added. [metcal.com] ESI Debuts Microvia Drilling System Electro Scientific Industries, Portland, Ore., has introduced the Model 5420, the first member of its dual-head laser microvia drilling platform. The system enables users to achieve lower costs by using a high-peak power laser that eliminates the need for pre-etching the copper. This process, according to ESI, produces clean, high-aspect-ratio vias. [esi.com]
New Wave Intros Laser for Microelectronics New Wave Research, Fremont, Calif., has announced the QuikLaze-50, a compact, pulsed, single- or multi-wavelength Nd:YAG laser cutting system designed for microelectronics machining. This latest generation of the QuikLaze features an increased repetition rate (boosted from 40 Hz to 50 Hz), an enhanced remote control panel and a redesigned power supply. Models feature user-selectable wavelengths of 1064 nm, 532 nm and 355 nm or 532 and 266 nm. [new-wave.com] Tessera Working with Intel on Stacked Next-Generation 'Wireless' CSPs San Jose-Tessera says it's working with Intel Corp. to develop advanced semiconductor packages for next-generation wireless and portable electronics. Tessera has developed prototypes of an initial stacked solution for Intel that can hold three die in a package with a total height of less than 1 mm. According to Tessera, "This is significantly lower than many two-die stacked packages" currently available. The package is based on technology Tessera developed for its µBGA package. First samples have already been sent to Intel, and Tessera expects to make the technology broadly available to the semiconductor industry before the end of the year. [tessera.com] New Desoldering System PACE Inc., Laurel, Md., has introduced the new VF 90 desoldering system, which combines conductive and convective methods for solder reflow. Designed for component rework on PC boards, the unit features a unique hot gas system with a long lasting stainless steel tip to remove solder from surface mount lands. [paceworldwide.com] Drying Module Integrates into Production Line and Works with Almost Any In-line Cleaner Austin American Technology, Austin, Texas, has introduced the TurboJet Dynamic Drying Module, a stand-alone, SMEMA-compatible unit that can be integrated into a production line. The unit operates in conjunction with virtually any in-line cleaner, according to AAT. The module employs a patented drying technology that physically removes water quickly and completely from even the densest and most complex electronic assemblies, without relying on energy-hungry heating or evaporation removal technologies. The system is available in several models with different drying speeds, and can be upgraded to meet the customer's throughput demands. [aat-corp.com] VisionStar Die Sorter Offers 2D/3D/PVI Inspection Laurier's new DS-7000 VisionStar die sorter integrates high-resolution inspection capabilities from Semiconductor Technolo-gies & Instruments into die placement with reduced cost of ownership and improved quality and productivity. The 2D/3D/PVI inspection/sorting system accommodates a variety of package types including singulated LFBGAs, µBGAs, CSPs and bumped and non-bumped die covering a broad component size range. The DS-7000 will accept both post-sawn wafer formats and matrix strip formats on a film frame. Bump inspection (gold or solder) verifies bump size, location, damage height and number. Visual resolution is down to 3 µm. [laurierinc.com]
Rotary Dispensing Table Simplifies Production The RT404-FLEX rotary dispensing table from I&J Fisnar Inc., Fair Lawn, N.J., can save time and money in automating a circular dispensing process. The unit provides automatic Z-axis dispensing with an adjustable angular approach to the rotating object. This feature enables the user to control the angle of dispensing for precise material deposition. [ijfisnar.com] August Technology Begins Direct Sales in Taiwan Bloomington, Minn.-August Technology Corp. has begun direct sales and support of its automated inspection equipment in Taiwan. The effort will be headed by Shao-Li Chu, director of operations for Taiwan and Southeast Asia, and will be supported locally by Vincent Wu, sales manager. [augustech.com] EV Group Sells SOI Wafer Bonding System to Clare Beverly, Mass.-Clare Inc. has signed an equipment purchase agreement with EV Group Inc., Cranston, R.I., for EVG's EV850 wafer bonding system with a 250 mm silicon-on-insulator wafer bonding capability. Clare will employ the unit for high-voltage analog and mixed-signal ICs. [evgroup.com] StratEdge Contracts with TriQuint Semiconductor San Diego, Calif.-StratEdge says that it has contracted to assemble and test TriQuint Semiconductor's OC-192 broadband amplifiers using patented, high-performance StratEdge packages. StratEdge has adapted its standard 580286 leaded ceramic power amplifier package for TriQuint's application. [stratedge.com] Leica Microsystems Moves Headquarters to Virginia Wetzlar, Germany-Leica Microsystems AG has moved the worldwide headquarters of its Semiconductor Equipment Division from Wetzlar to Chantilly, Virginia. [leica-microsystems.com] |
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