eMail the Editor
Attaching Die to Substrate: Rethinking a Traditional Assembly Process
Ron Iscoff, Editor.
CSPs are placing new demands on the makers of equipment for attaching and/or mounting the die to the substrate.
Progress of Worldwide Standards for CSPs
Dieter Bergman, IPC.
Standards now being developed will help the infrastructure manufacture chip-scale packages and mount them-and bare die- on organic PC boards.
Radial Lead Bonding Offers Increased Flexibility and Process control
Joseph F. Lippincott Jr., Kulicke & Soffa Industries
µBGA® Lead Bonding Process Requirements and Capabilities
Daniel Bolliger, Christian Brändli and Daniel Zanetti, ESEC SA.
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