July 1998 - ChipScale Review

July 1998


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LGA Test Sockets for Test and Characterization (Tecknit Interconnection Products)

Tecknit's land grid array test sockets provide virtually "invisible" interconnection between the device lands and device-under-test board pads for manual device characterization and automated production testing.

The proprietary Fuzz Button® contact pins are made from a single length of gold-plated wire. The wire is compressed into a cylindrical shape to produce contact elements with excellent electrical performance, according to the company.

Tecknit Interconnection Products, 129 Dermody St., Cranford, NJ 07016, 98.272.5500, fax 908.272.2741. www.tecknit.com


LGA test sockets



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© 1998 ChipScale REVIEW