Daito Corp. Offers New

CSP Device Handler

The WaferGage is a noncontact, laser-based wafer thickness inspection system.

Daito Corp. has introduced the DNA-55H IC handler. The unit is the latest addition to the Daito handler line and is designed to meet the demands of handling CSPs with ball pitches down to 0.5 mm.

Primarily a production machine, the DNA-55H includes active package alignment prior to insertion into the test socket (using optical pattern recognition or eddy-current sensing) and a unique force-and-stroke-regulated test arm design.

The test arm design, according to Daito, allows users to custom control test arm operation to optimize electrical test performance while simultaneously minimizing socket wear and the risk of device damage. The unit takes advantage of open socket designs to provide true, direct contact mode capability.

Multiple devices can be tested in parallel, with temperature testing from ambient to 125žC ±3žC.

Daito Corp., 1-46-7 Minamiota, Minamiku, Yokohama 232, Japan, +81.45.715.3711, fax +81.45.731.1755, www.daito.com

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