July - August 1999
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Sonoscan's Acoustic Imaging
System Designed for CSPsSonoscan Inc. has announced the D-9000 C-SAM acoustic imaging system for inspecting and evaluating CSPs and flip-chip devices.
The D-9000 offers Sonoscan's new VHR™ (very high resolution) electronics, which produces acoustic images up to 8,000 x 8,000 pixels to display fine details, such as solder bump bonds inside flip chips.
The unit includes Sonoscan's "waterfall" transducer, claimed to make immersion of the sample unnecessary. A tiny module riding on the transducer delivers a micro-stream of water just to the area where acoustic coupling is required. The sample is exposed to the fluid for only a very short time. Other fluids, such as alcohol, can also be used.
Zip-Slice™ and 3V™ software produces cross-sections. An Acoustic Solid™ buildup from individually optimized acoustic slices of the sample is rotated and sectioned to provide the best possible view of internal features.
Sonoscan Inc., 530 E. Green St., Bensonville, IL 60106, 630.766.7088, fax 630.766.4603.