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Features Dr. Gerald K "Skip" Fehr on IC Assembly & Packaging Trends Dr. Fehr received his Ph.D. in material science and engineering from Iowa State University. He has worked in semiconductor assembly and packaging since 1966. He co-founded the Integrated Packaging Assembly Corp., San Jose, in April 1993 and is currently vice president of operations and chief technical officer. Retrospective: An Interview with ESEC Chief Karl Nicklaus Since its founding in December 1958, Karl Nicklaus has built ESEC, once known as the European Semiconductor Equipment Co., now simply known by its initials, into an international leader in IC assembly equipment. In June, he stepped down as president and CEO "to let a younger man take over" after 31 years. We caught up with Karl in San Jose on the final stop of his annual U.S. press tour, which he said would be his last. Technical Forum Bonder and Tool Design Choices for CSPs The CSP and flip-chip markets are among the highest growth segments of the semiconductor industry (Figure 1). They are expected to expand to more than 5 billion units by 2003, with over 4 billion of these wire bondable CSPs.