Aries Electronics Inc. Debuts 'Unique' Hybrid Sockets for BGA and CSP Formats Frenchtown, N.J.-Aries Electronics has introduced a hybrid socket featuring a "unique" spring-type contact for use with BGA and CSP applications. The sockets are available with pitches of 1.0 mm and above for BGAs and as low as 0.5 mm for CSPs. The socket employs four threaded inserts for bolting the cover to the socket base. (Cover-attach screws are provided with the socket.) The socket housing also contains two locating pins to align the socket contacts precisely to the target board pads. Each socket is matched to the BGA device to ensure a perfect fit. Pricing for prototype quantities is from $0.10-$0.20/contact with delivery 4-6 weeks ARO. [arieselec.com] FeinFocus Announces F.O.X. Nanofocus X-Ray Inspection Stamford, Conn.-FeinFocus USA Inc. has introduced the industry's first nanofocus X-ray inspection system for sub-micron defect detection. Known as the F.O.X. (FeinFocus Opti-mized X-ray) system, the unit combines high resolution X-ray technology with advanced optics. The system offers total magnification up to 7,200x (2,400 geometric magnification) and feature recognition of 500 nm (0.5 microns), which the company says makes it ideal for PWB and IC makers to employ for real time inspection of a range of package types and bond wires. The unit is suitable for detailed inspection of samples up to 300 mm x 400 mm that weigh up to 10 kg. [feinfocus.com] |
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