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Current Issue
An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics
August - September 2001
Letter To the Editor

Re: Are MEMS, MOEMS and Opto-Electronics in Your Future?

Dear Editor:

I read the above-mentioned article published on your website (May-June Assembly Lines) with greatest interest. The vision you and your interviewees have about the opto-electronic market is pretty much in line with ours.

However, when you talked about the competitors on that market, I was very surprised not to find SYSMELEC in your list. Therefore, I would like to take the opportunity to present you our company and our solutions for the assembly and bonding of opto-electronic devices:

SYSMELEC is a Swiss automation company which has been in business for almost twenty years. Having been very active in the Swiss watch industry, we are used to providing solutions for handling and bonding small and delicate components with very high accuracy. It was therefore a natural step for SYSMELEC to enter the field of the assembly of microsystems back in 1992. As one of the very first companies, SYSMELEC has provided fully automatic assembly equipment specifically for opto-electronic devices.

Today, SYSMELEC is one of the leaders in that area, building high throughput, fully automated production machines that assemble and bond opto-electronic devices with ultra high accuracy, down to ± 0.1 µm if needed.

You will find enclosed some literature about our company and products. Please do not hesitate to contact me for any additional information you would like to receive. I would appreciate if you could mention SYSMELEC in any future article related to the assembly of opto-electronic devices.

Best regards and best wishes,

Farid Assaf, VP-SYSMELEC, Inc.

Sysmelec SA, Rue du Puits-Godet 22

Case postale 1534, CH-2002 Neuchâtel, Switzerland

[www.sysmelec.ch]

 
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