Kulicke & Soffa Introduces Trio of New Products
Company Upgrades Dicing System, Adds Blades and Lead-Free Solder Bumps
Kulicke & Soffa Industries, Willow Grove, Pa., has unveiled a new dicing system and blades and has qualified new solder alloys for flip-chip bumping.
The company has also upgraded its Model 7500 automatic dicing system with the Model 7500M, targeted to PBGA, MLF and QFN singulation.
The K&S Model 7500M
SEM shows bumps from lead-free alloy
New 7500M features include a high-powered, mechanically driven spindle, which enables multi-blade setups using a gang-type arbor.
The K&S Dicing Division has also introduced the AccuKerf Hub Blade, supplied in a new design claimed to improve cut quality and minimize damage in thick material and thin blade dicing applications. The item directly replaces existing Semitec-brand dicing wheels.
Finally, the company's Flip Chip Division (formerly Flip Chip Technologies), has qualified ultra-low-alpha and lead-free solder alloys for flip-chip bumping.
Targeting standard eutectic Sn/Pb compositions, the Flip Chip Division first introduced a low-alpha eutectic alloy to the market in December 1999. The new, ulta-low-alpha, eutectic Sn/Pb emits about 90 percent fewer alpha particles than its predecessor (0.002 alpha particles per hour/cm2).
The FCD's new Pb-free alloy is a Sn/Ag/Cu material that can support higher current densities and temperatures than conventional eutectic alloys. [kns.com]
The IS-3000 Video Inspection System
ASG's Solder Joint Video Inspection System Debuts
ASG, Cleveland, Ohio, a division of Jergens Inc., has introduced the ASG IS-3000, a new solder joint video inspection system.
The unit offers a magnification of 70X or 130X with a pixel resolution of 270,000. Its prism and backlighting design enables the system to inspect up to eight or nine balls from the edge of a BGA component. [asg-jersens.com]
Karl Suss' LithoPack 300
Suss Announces Lithography Unit for Wafer-Level Packaging
Karl Suss GmbH, Germany, has introduced a 300 mm lithography cluster specifically designed for wafer bumping and wafer-level packaging applications on 300 mm wafers.
The cluster consists of an MA300 mask aligner module linked to an ACS300 spin-coating system. The tool, designated the LithoPack300 (LP300), enables quick changeover from 300 mm to 200 mm wafers.
Suss says the LithoPack300 addresses the specific needs of WLP, which requires very thick photo resist layers of up to 100 microns and BCB or polyimide processing.
The spin-coating modules include Suss' patented GYRSET technique that offers material savings. Other packaging-specific features, including edge bead removal, have also been integrated into the cluster.
Together with modules for resist bake and resist developing, the cluster can be configured for any thick resist process. The exposure unit is a 300 mm full-field proximity mask aligner. [suss.de]
Phoenix X-Ray's Contrast Detector Bows as Option
Phoenix X-Ray Systems, Camarillo, Calif., has introduced the High-Contrast-Detector, said to enable "superior detection of pre-preg voids, microvias and moulding voids." The unit is offered as an option to Phoenix X-Ray's PCBA or Package-Analyzer. [phoenix-xray.com]
Dymatix Intros Fast Die Sorter
Dymatix Automation Systems, Santa Clara, Calif., has introduced two high- speed die sort systems with dedicated output assemblies. Designated the V-line 1200 and 1300, the units can be fitted with either tape and reel, surf tape or JEDEC/ GelPak waffle pack stack load outputs.
The automatic 200 mm- and 300 mm-capable platforms are designed for high productivity, low cost die transfer of pre-sawn flip chip, GaAs ICs and BGA devices. [dymatix.com]
Coreco Upgrades Software
Coreco Imaging, St. Laurent, Quebec, Canada, has upgraded its software library for high-performance image acquisition, processing and analysis with the introduction of SAPERA 4.0.
The suite features enhancements to speed applications development, including 1-bit binary image support, C++ classes, ActiveX controls, an application wizard, a camera configuration utility and support for Coreco's SMART Series of add-on software libraries. [corecoimaging.com]
Zecal Offers Ceramic Chip-Scale Packaging
Zecal Technology, Rochester, N.Y., is offering ceramic chip-scale packaging based on JEDEC outlines. Both wirebond and flip-chip attachment can be used. Zecal also offers photo-defined copper-plated conductors to enhance high-speed digital and high-frequency electrical performance. [zecal.com]
QubePak Modules Available
ThetaDelta Technologies, Lawrence, Mass., is offering the QubePak module for test and burn-in of laser diodes. The QubePak module will control the temperature of a single or multiple DUT and applies programmable DC and AC voltage stimulus to each DUT. [thetadelta.com]
Litton-Kester Announces 'All-Weather' Solder Paste
Litton Kester, Des Plaines, Ill., has introduced R562, a general application, water-soluble solder paste for reduced voiding in BGA attach operations.
Kester's R562 has been specifically engineered to print in extreme environmental conditions "ranging from very arid to tremendously humid climates," according to the company. Kester's combination of activators and solvent systems allow R562 to "virtually eliminate BGA voiding."
Power Devices Debuts Thermal Materials
Power Devices Inc., Laguna Hills, Calif., a division of Loctite Corp., has introduced two new high-performance phase change thermal interface materials, Powerstrate 51 and Power-strate 60.
The Powerstrate materials are alternatives to thermal grease for processor heat sink attach, and are claimed to offer "excellent thermal properties without the problems associated with migration and thermal compound 'pump-out.'" [loctite.com]
Powerstrate 51 and 60 offer an alternative to thermal grease for heat sink attachment.
Loctite's new "environmentally friendly" cleaner
Multicore Offers No-Clean, High-Speed Solder Cream
Multicore Solders Inc., a division of Loctite Corp., Richardson, Texas, has introduced Multicore RP11, a high-speed, no-clean solder cream suited to fine-pitch stencil printing at rates up to 150 mm/s.
RP11 is a low-viscosity, highly thixotropic solder cream that ensures excellent definition and "slump" resistance, while maintaining good roll and drop-off behavior, according to the company. The solder does not require high squeegee pressures, making the product particularly suitable for second-side printing processes. [multicore.com]
Loctite Announces 'Environmentally Friendly' Solvent-Based Cleaner
Loctite Corp., Rocky Hill, Conn., has introduced Loctite 7360, a non-CFC, low-odor, solvent-based cleaner designed to remove uncured surface mount adhesive and its residue from stencils, screens and dispensing nozzles, as well as misprints applied directly to PWBs.
The cleaner is said to be fully compatible with epoxy adhesives and will not cause adhesives to harden during the soaking process. Loctite 7360 is also environmentally friendly, non-corrosive and contains no ozone- depleting chemicals. [loctite.com]