Dr. Rao Mahidhara of X-Lam Technologies (left) hears the latest news from Dr. Subash Khadpe, president of the Semiconductor Technology Center.

Brian Eisenach, Loctite Corp., describes the company's newest adhesive formulations to a visitor.

Speedline ACCEL's Shean Dalton (left) greets old friends Michael Mittag and Alan Roberts (right) of Corfin Automation, Salem, N.H.

From left, Phil Davies, president of Allteq Industries, Fremont; Peter Lau of UST Technology Pte., Singapore and Bill Miller, Allteq CEO, share a laugh.

Richard Boulanger, vice president-advanced semiconductor assembly for Universal Instruments Corp. (left), demonstrates new equipment for Dr. Skip Fehr, IPAC vice president.

Robin Seah of ASA Singapore gathers information for a show visitor.

Dick Ribas, Credence Systems, Fremont, Calif. (left) visits with Gordon Daggy, president of Ridgaway Communications.

From left, Jerry Kawano, Dean Higa, President/CEO Satoshi Nagata and Tatsuo Aoki of Mitsui High-tec describe the company's expanded leadframe and packaging services.

Joe Savarese, Electroglas vice president, demonstrates a new probing system.

From left, John Insana and Lonny Plummer, Alphasem, greet IPAC visitors Blesildo Ordona, Emmanuel De Los Santos and Chris Ooi.

Traffic was brisk at the Amkor Technology booth as visitors stopped by to see the IC assembly giant's newest packages.

Mike Erickson, product sales manager for GPD, demonstrates a new dispensing system.