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Features Solder Ball Attachment: An Equipment Review. Ron Iscoff, Editor. Machine accuracy is the key to selecting equipment for placing solder balls. Lead-Free Solder for Surface Mount Technology Applications. Mulugeta Abtew, SCI Systems and Dr. Guna Selvaduray, San Jose State University. Legal and technological issues are pressing for alternatives to lead-based solders. Technical Forum Strip Assembly Attachment of Solid Core Balls CSP's. Dr. Rao Mahidhara, Vern Solberg, Wael Zohni and Joseph C. Fjelstad, Tessera Inc. Solder Jet Printing: Wafer Bumping and CSP Applications Drs. Donald J. Hayes and David B. Wallace, MicroFab Technologies Inc.