eMail the Editor
Solder Ball Attachment: An Equipment Review.
Ron Iscoff, Editor.
Machine accuracy is the key to selecting equipment for placing solder balls.
Lead-Free Solder for Surface Mount Technology Applications.
Mulugeta Abtew, SCI Systems and Dr. Guna Selvaduray, San Jose State University.
Legal and technological issues are pressing for alternatives to lead-based solders.
Strip Assembly Attachment of Solid Core Balls CSP's.
Dr. Rao Mahidhara, Vern Solberg, Wael Zohni and Joseph C. Fjelstad, Tessera Inc.
Solder Jet Printing: Wafer Bumping and CSP Applications
Drs. Donald J. Hayes and David B. Wallace, MicroFab Technologies Inc.
Chip Scale Review o 7291 Coronado Drive, Suite 8 o San Jose, CA 95129 o Email: email@example.com
9809, 0/02/25, 0/02/25, ID=CSadd/chipscale7
© 2000 ChipScale REVIEW