September 1998 - ChipScale Review

September 1998

eMail the Editor

Technical Program Topics

January 12 & 13, 1999

National Chiao Tang University
Hsin Chu, Taiwan

Program Themes

  • New Markets for µBGA
    New Memory Applications
    Rambus Memory Cards
  • Automation for Cost Reduction

For attendance information contact:

Lara Fjelstad


fax: 408.894.0285
e-mail: laraf@tessera.com

For exhibiting information contact:

Page Hecker


tel: 408.383.3686
fax: 408.894.0285
e-mail: pageh@tessera.com

CSP Manufacturing

  • Low Cost µBGA Manufacturing with
    Full Line Integration
  • Advanced µBGA Die Bond for In-Line Assembly
  • Long Life Optimized µBGA Lead Bonding Tool
  • Flexibility and Control with Radial Lead Bonding
  • Improved Encapsulation Materials for µBGA
  • Vacuum Injection Encapsulation
  • Automated 300µm Diameter Ball Attachment
  • Evolution of CSP-Roadmap to the Future

CSP Test and Reliability

  • Qualification Test Methods
  • Environmental Requirements
  • Test Sockets
  • Burn-in

Systems Design

  • Performance Modeling
  • Parametric Measurements
  • Thermal Management
  • Tiled Silicon Systems

Emerging HDI/PCB Technology

  • Design for High Component Density
  • High Density Fabrication Processes
  • Guidelines for Adapting Micro-vias
  • Materials for HDI Applications

CSP Design

  • Chip-Scale and Chip-Size (CSP)
  • High Density CSP
  • Wafer Level Packaging
  • New Applications

Assembly Applications

  • Solder and Flux Selection
  • Solder Processes for CSP
  • Automated CSP Assembly
  • CSP Rework and Repair

Call for Papers


You are invited to submit a paper for presentation at the electronic industries primary technical forum for chip-scale packaging and related technology. Papers must comply with publication guidelines, be approximately six pages in length and not exceed 30 minutes for oral presentation. The paper will be published as a part of the programs proceedings for distribution to attendees. Speakers will receive one complimentary copy of the proceedings and have full access to all technical sessions at no charge.

Please send your abstract to:


Vern Solberg
c/o Chip Scale Review Magazine
3099 Orchard Drive
San Jose, CA 95135
Fax: 408.894.0768

Chip Scale Review o 7291 Coronado Drive, Suite 8 o San Jose, CA 95129 o Email: editor@chipscalereview.com



 Info, 98/10/06, 05/13/99, ID=9809/techprogm1
Keywords=

© 1998 ChipScale REVIEW