Current Issue An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics October 2001 Email the editor

The Amkor-Philips agreement follows a recent collaboration between the companies at Amkor's new Waigaoqiao, China, facility. This gate is at the free trade zone near that plant.

Amkor-Philips Semi Sign Business, Technology Pact

Eindhoven, The Netherlands-Philips Semiconductors, a division of Royal Philips Electronics, and Amkor Technology have agreed to a "multilevel exchange of technology, joint development of technology and business expansion."

The companies said they will share intellectual property, process knowledge and patented or patent-pending technologies that have been proven in key industry segments.

Amkor Revenue Drops 36% over Prior Second Quarter

Chandler, Ariz.-Amkor Technology Inc. reported that its total revenue for the second quarter ended June 30 was $350 million, compared to $547 million in the same quarter last year.

Of that revenue, assembly and test accounted for $311 million, down 33 percent from $463 million in the same quarter last year. Second quarter wafer-fab revenue accounted for $39 million, compared with $84 million in the same quarter of last year. [amkor.com]

STATS Acquires 51% Interest in Taiwan-Based Test House

Singapore-STATS, based here, has signed an agreement to buy a 51 percent interest in Winstek Semicon-ductor Corp., a test house based in Hsin-Chu, Taiwan. STATS will acquire the majority interest for about $28 million.

Winstek, a private company, was incorporated in April 2000. It is outfitted to test optical mixed-signal, digital and RF devices. Winstek also offers wafer probe, final test, turnkey and drop shipment from a 220,000-square-foot plant. [stts.com]

Alpha-Fry Technologies, STS Ink Flip-Chip Process License

Manteca, Calif.-Silicon Turnkey Solutions has signed a license agreement with Cookson's Alpha-Fry Technologies, Alpharetta, Ga., to employ a one-step underfill/overmold process for flip-chip packages.

Cookson Semiconductor Packaging Materials, a business unit of Alpha-Fry, owns the exclusive rights to use the Hestia-developed process and to sublicense the technology. [cooksonsemi.com] [siliconturnkey.com]

OSE USA Inc. Launches Micro Leadframe-Based CSPs

San Jose-OSE USA Inc. (formerly IPAC), is offering assembly of CSP micro leadframe packages.

The company says it is the only onshore IC packaging foundry providing MLP assembly services. [ose-usa.com]

Mitsui, 3 Others Agree to Provide Turnkey Services

Fukuoka, Japan-Packaging foundry Mitsui High-tec Inc., headquartered here, has joined with Genesis Technology, Hyogo, Japan; Nippon Foundry Inc., Chiba, Japan; and Toppan Printing Co., Tokyo, to provide turnkey semiconductor development and production.

Mitsui High-tec will handle assembly, while Nippon Foundry, the only independent, Japan-based silicon foundry, will offer wafer fabrication. Genesis, an independent test operation with three locations in Japan, will provide test support. Toppan Printing supplies photomasks, leadframes and various substrates. [mitsui-high-tec.com]

CS2 Freed from Creditor Protection Status by Brussels Court

Brussels-The Commercial Court of Brussels has freed packaging foundry CS2 from creditor protection, and has accepted CS2's restructuring plan.

According to the company, the major consequences of the restructuring are that a majority of debts are converted into convertible bonds. These bonds may be converted into CS2 shares by June 20, 2003.

"This means that except for further bridge financing or loans, the company will be debt free. CS2 has approximately 60 million (about US$55 million) Euro of assets," according to Yves de Poorter, president.

De Poorter said the ramp-up in PSGA production and the qualification and production of flip-chip products for Internet backbone transmissions "are very promising." [cs2.be]