Ablestik's New Adhesives Aimed at Lead-Free Assembly Ablestik, a National Starch and Chemical Co., Rancho Dominguez, Calif., has added the ABLEBOND 2025 series of electrically insulating die attach adhesives for PBGA, flex BGA and die-to-die applications to its catalog. The company says the materials in this series offer 260\°C IR reliability for lead-free IC package assembly. The series also features low moisture absorption, high hot/wet adhesion, low stress and the ability to be snap cured. [ablestik.com] GSI Lumonics Intros System for Copper Fuse Processing GSI Lumonics, Ontario, Canada, has introduced the WaferRepair M430 for processing metal links during memory repair. The system employs the company's ShapedPulse energy management technology to help in the processing of metal, including copper, links without damage to adjacent links or low-K dielectric layers. [gsilumonics.com] Asymtek Heli-Flow Pump Provides Reliable Dispensing Asymtek, a unit of Nordson Electronics Systems, Carlsbad, Calif., has announced the latest generation of DV-7000 series rotary positive displacement auger pumps, the DV-7000 Heli-Flow. The DV-7000 models feature hardened augers for dispensing epoxy-filled material with high flow rate for fast dam writing. The DV-7000 offers four interchangeable cartridges in a leur needle configuration. Unlike standard auger pumps, the feedscrew is not custom fitted to the pump body and can be replaced. [asymtek.com]
Glenbrook Technologies Offers Variable Angle Viewing Glenbrook Technologies, Randolph, N.J., has announced variable angle viewing (VAV), a newly developed feature, for its RTX113HV X-ray inspection system. VAV is accomplished through the rotation of the X-ray source and permits oblique viewing of many area array package formats to detect defects like non-wetting and bad solder joints. [glenbrooktech.com] Siemens' Wafer ID System Claims to Be 'The Smallest' The recently introduced LKx5 is the smallest stand-alone wafer ID system available, according to its manufacturer, Siemens Dematic AG, Nuremberg, Germany. The unit can identify OCT, bar and 2D dot matrix codes which have been applied to the front or back of the wafer. Because of its small dimensions (37 mm x 70 mm x 110 mm), the LKx5 can be integrated into every step in semiconductor production, Siemens reports. [nbgm.siemens.de]
ATV Adds Robotics to SRO-704 Thermal Processor ATV Technology, North Reading, Mass., has added integrated robotics to its SRO-704 thermal process system, enabling a completely automatic cassette-to-cassette process. The addition, which employs GENMARK robotics, reduces labor while still providing a void-free product, according to ATV. The system features vacuum processing and overpressure to 30 psi, temperature ramp speed greater than or equal to 20\°C/second, fluxless soldering and flat pack encapsulation. [atvtechnology.com] Accutek MicroCircuit Corp. Debuts Memory Adapters Accutek Microcircuit Corp., Newburyport, Mass., has introduced a line of DRAM and SRAM DIP and ZIP adapters that are pin-to-pin compatible for end-of-life ICs used in telecom, machine vision, networking and high-speed graphics applications. These "AccuAdapters" integrate existing SMT devices into modules that become direct drop-in replacements for monolithic or discrete DIP and ZIP ICs and eliminate the need for PC board retooling. [accutekmicro.com]
Dage X-Ray System Targets Encapsulated IC Inspection Dage Precision Industries Inc., Fremont, Calif., has introduced the XL 6000 X-ray inspection system, targeted at QA tasks, such as die bump checking and wire sweep inspection of encapsulated ICs. Additionally, PC board makers may employ the system to check the integrity of terminations hidden beneath area array component packages, such as BGAs and CSPs, as well as flip-chip die. [dage-group.com] Keithley Test System Offers DC and RF Measurements Keithley Instruments Inc., Cleveland, Ohio, has announced a single-insertion RF and DC parametric test system for probing communications and high-speed digital wafer devices. When employed with a suitable test structure layout, the model S4000DC/RF ATE System can perform DC and RF tests independently and in parallel, which is claimed to reduce the cost of test on wafers with advanced ICs. [keithley.com] Smart Sonic Corp. Intros Stencil Inspection System Smart Sonic Corp., Van Nuys, Calif., is offering the StencilScan stencil and screen inspection system designed for SMT assembly. The system employs a fully integrated, offline inspection workstation using a Windows-based software package integrated with a high-resolution, calibrated A3-size flatbed scanner. [smartsonic.com]
Micro Control Co. Begins ABES-V System Deliveries Micro Control Co., Minneapolis, says deliveries of its ABES-V automatic burn-in and environmental test system have begun, with shipment to a leading computer maker. The system performs dynamic burn-in or environmental stressing of analog, logic and memory devices through the use of a vector-based pattern generator and analog-programmable generators. [microcontrol.com] Mühlbauer's High-Speed Die Sorter Uses Modular Concept The Mühlbauer Group, Roding, Germany, has developed a new high-speed die sorter, the DS6000, which offers a throughput of up to 6,500 UPH. The sorter is configured for tape with reel-to-reel handling. The DS6000 picks good die from the wafer and places them onto carrier tape or surf tape and is equipped with hot or cold sealing stations. The system is available with an option for handling flip chips. [muhlbauer.de] |
Copyright © 2001