Media Kit
For advertisements and demographics
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 Current Advertisers

List of the sponsors

 Publisher's Letter
Reflections from My Alaskan Fishing Trip

 Assembly Lines
Back to the Future: New Funding Propels Alphatec along Recovery Trail

 Electronic Trends
Application-Driven Integrated Passives (SiPs) Offer Low Die Cost

 Standards
Pricing Challenges Loom Large in Industry Roadmaps for 2000

 Harvey Miller's Notebook

Convergence Ahead? EMS Providers Enjoying Strong Growth

 On Test
That Nagging Question Again: 'Daddy, What Do You Do At Work?'

 CSP Automation
Strip Maps Provide Package Tracking, Other Benefits in CSP Assembly

 Industry News
PackCon 2000 Highlights
Packaging Foundries
People in the News
Company News
Calendar of Events
Editorial Calendar for 2001

 Features
The (Electronic) Eyes Have It! Machine Vision Systems Reveal Flaws
Complex Devices, Tighter Bump Pitches Require 100% Inspection

 Tutorials
How Machine Vision Solves Inspection Challenges

 Technical Forum
CSP Assembly Reliability After Accelerated Thermal and Mechanical Cycling
An Expert Looks at the Issues

 Tools & Technologies
ELECTROVERT Announces Bravo 8105 Oven and more

 Patents
Wafer-Level Process Employs Wire Bonds to Form Bumps

 Archives
2001
Jan-Feb March April
May-June July  
2000
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1999
Jan-Feb Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec
1998
  Mar-Apr May-June
July-Aug Sept-Oct Nov-Dec



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 This month issue
An Independent Journal Dedicated to the Advancement of Chip - Scale Electronics

November - December 2000

Email the editor

 Reflections from My Alaskan Fishing Trip

I just returned from a weeklong fishing trip to Ketchikan, Alaska. The weather was bad and the fishing was not much better (although I did catch several Coho salmon and a 54-pound halibut!).

Beyond that, however, a week in the (near) wilderness provided me with some time to reflect on the progress of Chip Scale Review.

We have accomplished much in our first millennium year: We have reinforced the magazine's leadership position in the chip-scale electronics and wafer-level packaging world. We have expanded our editorial coverage of flip-chip (by popular demand). And we continue to set the quality precedent in each issue by including detailed directories-not just names and addresses-of the key providers of the equipment and materials that we feature.

Additionally, we have increased our circulation to include the distribution of extra copies at all of the major SEMI-sponsored shows. While-it's true-you won't see us at every show, you will see us at every show that's important to our readers and our advertisers! And we will provide editorial coverage of every show that's significant to the chip-scale electronics market.

On that subject, you'll see a story in this issue's news section about the Taiwan Semiconductor Day program held recently in Silicon Valley. You probably won't see a story about this event in our competitors' publications, but Editor Ron Iscoff and I were there to cover this important event. Being the only packaging magazine headquartered in Silicon Valley, continues to offer advantages for you, our readers.

As we announced last issue, we're increasing our frequency to eight times next year, to keep pace with the growth of this market. If you'd like a preview, our complete editorial calendar is available on our website, www.ChipScaleReview.com. Our media kit for 2001 is also now available, both on the Web and via mail. Just let me know if you'd like a copy.

Beginning with the last issue, you probably noticed the small numbers at the bottom (or sometimes the top) of each ad. These online reader service numbers offer a quick and convenient way to get more info fast online. Try it and tell me what you think.

We have more good things in store for you soon, whether you're an advertiser or a reader. Please drop me a line at gselven@aol.com with your reflections, comments, criticisms or fish stories. (Local fishing recommendations are always welcome, too!)

Gene Selven, Publisher
gselven@aol.com.

 
 
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