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Features Guest Editorial: Quality Assurance and Reliability: A System Approach Dr. Reza Ghaffarian Key Factors in Chip-Scale Package Assembly Reliability Dr. Reza Ghaffarian, Jet Propulsion Laboratory, California Institute of Technology, Pasadena, Calif. Technical Forum High Reliability Telecommunications Equipment: A Tall Order for Chip-Scale Packages Dr. Theo 1. Ejim, Lucent Technologies, Princeton, N.J. Achieving an Optimum Structural Package Design with Thermo-Viscoelastic Analysis By Gen Murakami and Mamoru Mita, Hitachi Cable Ltd., Hitachi-City, Japan, and Shozo Nakamura, Keii Ueno and Keiichi Nakamura, Hitachi Ltd., Yokohama, Japan.