November- December 1998
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Table 4. Misleading CSP Cycles-to-Failure Projections by Modeling
| Package Type | I/O | Cycle Profile | Cycles to Failure Projection | Test Results |
| TAB CSP | 46 | -55/125°C | 7,000 | 500-1,000 |
| Wafer-Level CSP | 96 | -55/125°C | 3,200 | 200-500 8 failures |
| Flip-Chip CSP | N/A | -55/125°C | 20,000 | N/A |
| Low Cost CSP | N/A | -40/125°C | 21,000 | N/A |