November- December 1998 - ChipScale Review

November- December 1998


eMail the Editor

Table 4. Misleading CSP Cycles-to-Failure Projections by Modeling

Package Type I/O Cycle Profile Cycles to Failure Projection Test Results
TAB CSP 46 -55/125°C 7,000 500-1,000
Wafer-Level CSP 96 -55/125°C 3,200 200-500 8 failures
Flip-Chip CSP N/A -55/125°C 20,000 N/A
Low Cost CSP N/A -40/125°C 21,000 N/A


Chip Scale Review o 7291 Coronado Drive, Suite 8 o San Jose, CA 95129 o Email: editor@chipscalereview.com



, 99/05/07, 05/13/99, ID=9811/tablefour1
Keywords=

© 1998 ChipScale REVIEW