The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century

Current Issue: March - April 2012

• 2012 OSATS/ IC Packaging Foundries Update
• International Directory of IC Packaging Foundries
• Heterogeneous Integration
• Plasma in WLP
• MEMS - Standards in a Maturing Industry
• Thin Wafer Processing of 3D ICs

Read the Issue

Download Issue

Subscribe

Issue Archives 2012 Issues Jan - Feb 2011 Issues Jan - Feb Mar - Apr May - Jun Jul - Aug Sep - Oct Nov - Dec     2010 Issues Jan - Feb Mar - Apr May - Jun Jul - Aug Sep - Oct Nov - Dec

CSR Stock Index
Symbol	Name	Last	Pct Change
ASX	Advanced Semicond	4.76	0.00
AEHR	Aehr Test Systems	1.20	0.00
AMKR	Amkor Technology	4.49	0.00
AMAT	Applied Materials	10.66	0.00
ASMI	ASM International	38.07	0.00
CSCD	Cascade Microtech	4.64	0.00
IMOSD	IMOSD	0.00	0.00
INTC	Intel Corporation	26.50	0.00
KLAC	KLA-Tencor Corpor	47.11	0.00
KLIC	Kulicke and Soffa	11.48	0.00
LRCX	Lam Research Corp	38.87	0.00
NEWP	Newport Corporati	12.17	0.00
NDSN	Nordson Corporati	50.87	0.00
QCOM	QUALCOMM Incorpor	59.11	0.00
RTEC	Rudolph Technolog	8.81	0.00
ST	Sensata Technolog	30.46	0.00
SPIL	Siliconware Preci	5.30	0.00
STM	STMicroelectronic	4.91	0.00
TGAL	Tegal Corporation	3.52	0.00
Refresh page to update