The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century

Current Issue: July - August 2010

• State-of-the-Art Thin Wafer Processing
• Solder Paste Properties for Die-Attach Processes
• Ga Tech's Vision for Ultra-miniaturized Packaging
• Combined Clean Rooms Creates Efficiency
• International Directories:
  • Automated Encapsulation Systems
  • Adhesive, Underfill & Encapsulant Suppliers

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CSR Stock Index
Symbol	Name	Last	Pct Change
ASX	Advanced Semicond	3.57	0.00
AEHR	Aehr Test Systems	1.17	0.00
AMKR	Amkor Technology	5.41	0.00
AMAT	Applied Materials	10.79	0.00
ASMI	ASM International	23.06	0.00
CSCD	Cascade Microtech	3.99	0.00
IMOS	ChipMOS TECHNOLOG	0.93	0.00
INTC	Intel Corporation	18.28	0.00
KLAC	KLA-Tencor Corpor	29.77	0.00
KLIC	Kulicke and Soffa	5.90	0.00
LRCX	Lam Research Corp	37.73	0.00
NEWP	Newport Corporati	10.37	0.00
NDSN	Nordson Corporati	68.09	0.00
QCOM	QUALCOMM Incorpor	40.02	0.00
RTEC	Rudolph Technolog	8.60	0.00
ST	Sensata Technolog	17.91	0.00
SPIL	Siliconware Preci	4.61	0.00
STM	STMicroelectronic	7.07	0.00
TGAL	Tegal Corporation	0.36	0.00
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