The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century
Current Issue: July - August 2010
  • State-of-the-Art Thin Wafer Processing
  • Solder Paste Properties for Die-Attach Processes
  • Ga Tech's Vision for Ultra-miniaturized Packaging
  • Combined Clean Rooms Creates Efficiency
  • International Directories:
    • Automated Encapsulation Systems
    • Adhesive, Underfill & Encapsulant Suppliers
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SymbolNameLastPct
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ASXAdvanced Semicond3.570.00
AEHRAehr Test Systems1.170.00
AMKRAmkor Technology5.410.00
AMATApplied Materials10.790.00
ASMIASM International23.060.00
CSCDCascade Microtech3.990.00
IMOSChipMOS TECHNOLOG0.930.00
INTCIntel Corporation18.280.00
KLACKLA-Tencor Corpor29.770.00
KLICKulicke and Soffa5.900.00
LRCXLam Research Corp37.730.00
NEWPNewport Corporati10.370.00
NDSNNordson Corporati68.090.00
QCOMQUALCOMM Incorpor40.020.00
RTECRudolph Technolog8.600.00
STSensata Technolog17.910.00
SPILSiliconware Preci4.610.00
STMSTMicroelectronic7.070.00
TGALTegal Corporation0.360.00
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